Patent classifications
C08L2312/04
Rubberized textile material for a belt ply, associated rubber mixture and belt
The rubberized textile material for a belt textile ply is provided on at least one side of a textile web with a peroxidically crosslinkable ethylene-alpha-olefin-diene terpolymer rubber mixture, preferably an EPDM mixture. In this rubberization mixture the third monomer content (diene content) of the EPDM is preferably at least 4% and the rubber mixture contains: a peroxidic crosslinker, a mineral oil having an aromatics proportion of at least 50 percent by weight and at least one reactive phenol and/or reactive phenol resin capable of binding to the double bonds of unsaturated polymers. The reactive phenol and/or phenol resin and the mineral oil are present in the rubber mixture in a content of altogether 5 to 60 phr. The rubberization has an exceptional manufacturing tack coupled with good adhesion and good dynamic properties.
RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator,
##STR00001##
wherein A represents a single bond or a divalent organic group selected from the following formulae.
##STR00002##
This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.
RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator,
##STR00001##
wherein A represents a single bond or a divalent organic group selected from the following formulae.
##STR00002##
This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.
Thermoplastic vulcanizate compositions
In methods for forming thermoplastic vulcanizates, and thermoplastic vulcanizates formed by such methods, a masterbatch comprising one or more additives in a carrier resin comprising propylene- or ethylene-based copolymer is added to the thermoplastic vulcanizate formulation. The resulting thermoplastic vulcanizate may additionally be passed through a 200 mesh or finer screen and thereafter extruded. The thermoplastic vulcanizates may exhibit increased extrusion throughput rates and enhanced surface smoothness.
Thermoplastic vulcanizate compositions
In methods for forming thermoplastic vulcanizates, and thermoplastic vulcanizates formed by such methods, a masterbatch comprising one or more additives in a carrier resin comprising propylene- or ethylene-based copolymer is added to the thermoplastic vulcanizate formulation. The resulting thermoplastic vulcanizate may additionally be passed through a 200 mesh or finer screen and thereafter extruded. The thermoplastic vulcanizates may exhibit increased extrusion throughput rates and enhanced surface smoothness.
Phenolic resin composition and phenolic resin cured product
The phenolic resin composition of the present invention includes a novolac-type phenolic resin, a resorcinol resin, and a curing agent, and is of a solid form. The mixing ratio of the resorcinol resin is preferably more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin. The mixing ratio of the curing agent is preferably more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin. The phenolic resin cured product is obtained by heat-curing the phenolic resin composition.
CELLULOSIC ARTICLES MADE FROM CELLULOSIC MATERIALS AND METHODS THEREFOR
The invention relates to systems and techniques for manufacturing articles containing cellulosic material, a coupling agent, and a binder resin, and related processes of making and using the cellulosic articles. In particularly exemplary embodiments, the manufactured articles are door skins, sometimes known as door facings, and doors made from the door skins. The article contains a lipophilic cellulosic material, a coupling agent, and a binder. The coupling agent is believed to increase the hydrophilicity (wetability) of the lipophilic cellulosic material.
High rigidity rubber composition
Rubber compositions and rubber articles manufactured from such rubber compositions that include the well-known antioxidant poly-2,2,4-trimethyl-1,2-dihydroquinoline (TMQ) having the formula (C.sub.12H.sub.15N).sub.n where n=24 as well as a methylene acceptor/donor system reinforcing resin. Such embodiments include a tire component comprising a rubber composition that is based upon a cross-linkable elastomer composition, the cross-linkable rubber composition comprising, per 100 parts by weight of rubber (phr), a highly unsaturated diene elastomer, reinforcing filler, between 0.5 phr and 10 phr of TMQ and the methylene acceptor/methylene donor.
EPOXY RESIN COMPOSITION
One of the objects of the present invention is to provide an epoxy resin composition that has excellent curability and storage stability, and that gives a cured product with excellent adhesive strength. The present invention provides an epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin in a form of liquid at 25? C., having, per molecule, one or more functional groups having an aliphatic carbon-carbon double bond, (C) a microcapsule-type curing accelerator, (D) an imidazole compound having a triazine ring, and (E) an inorganic filler.
Cross-linking of carboxylated nitrile rubbers by means of cross-linking systems containing resol
The invention relates to vulcanizable compositions based on carboxylated nitrile rubbers, at least one resol crosslinker, at least one silicatic filler and at least one specific silane, to a process for preparing these vulcanizable compositions, to a process for producing vulcanizates therefrom and to the vulcanizates thus obtained. The vulcanizates feature good mechanical and dynamic properties and an excellent compression set.