C08L2312/04

Polymer Compositions and Processes for Their Production

Provided herein are polymerization processes and polymer compositions including reactor blends formed by such polymerization processes. The polymerization processes include copolymerization using two metallocene catalyst systems: the first catalyst system capable of producing polymers having 60% or more vinyl terminations, the second catalyst system capable of producing high molecular weight polymers, preferably incorporating at least some of the polymers produced by the first catalyst system into the high molecular weight polymers. The reactor blends formed thereby therefore include first and second copolymer components, which may differ in monomer content and weight-average molecular weight (Mw). Furthermore, the reactor blends may exhibit advantageous rheological properties, at least some of which are consistent with long-chain branching. Preferred reactor blends comprise ethylene-propylene-diene (EPDM) terpolymers.

Compositions, Vulcanizates, and Cure Processes
20250043123 · 2025-02-06 ·

The present disclosure relates to compositions and elastomer cure processes. In at least one embodiment, a composition includes a phenol formaldehyde resin; a bisthiosulfate; and an elastomer comprising (1) a C.sub.4 to C.sub.7 isoolefin-derived monomer, a non-halogenated alkylstyrene monomer, and a halogenated alkylstyrene monomer, or (2) a C.sub.4 to C.sub.7 isoolefin-derived monomer and a halogenated diolefin. In at least one embodiment, a bromine-containing vulcanizate has a Mooney Viscosity (ML, 1+4@100 C.) of 75 to 92; a cross-linking level (MH-ML) of 10 dNm to 19 dNm; a modulus at 300% of 3 MPa to 10 MPa; a anergy at break of 3J to 5J.

PHENOLIC RESIN COMPOSITION AND PHENOLIC RESIN CURED PRODUCT
20170190900 · 2017-07-06 · ·

The phenolic resin composition of the present invention includes a novolac-type phenolic resin, a resorcinol resin, and a curing agent, and is of a solid form. The mixing ratio of the resorcinol resin is preferably more than or equal to 1 part by mass and less than or equal to 100 parts by mass with respect to 100 parts by mass of the novolac-type phenolic resin. The mixing ratio of the curing agent is preferably more than or equal to 5 parts by mass and less than or equal to 25 parts by mass with respect to 100 parts by mass of a total amount of the novolac-type phenolic resin and the resorcinol resin. The phenolic resin cured product is obtained by heat-curing the phenolic resin composition.

RUBBER COMPOUND TO PRODUCE TYRES
20170130037 · 2017-05-11 · ·

A rubber compound for tyres comprising at least one cross-linkable polymer base, a reinforcing filler, a vulcanization system, a reinforcing resin and a dithiol chemical with formula (I)


SHRSH (I)

wherein R is an aliphatic or aromatic group composed of 3-12 atoms.

HIGH RIGIDITY RUBBER COMPOSITION

Rubber compositions and rubber articles manufactured from such rubber compositions that include the well-known antioxidant poly-2,2,4-trimethyl-1,2-dihydroquinoline (TMQ) having the formula (C.sub.12H.sub.15N) where n=24 as well as a methylene acceptor/donor system reinforcing resin. Such embodiments include a tire component comprising a rubber composition that is based upon a cross-linkable elastomer composition, the cross-linkable rubber composition comprising, per 100 parts by weight of rubber (phr), a highly unsaturated diene elastomer, reinforcing filler, between 0.5 phr and 10 phr of TMQ and the methylene acceptor/methylene donor.

Resin composition and gate insulating film
09617408 · 2017-04-11 · ·

A resin composition containing a resin (A) which contains a hydroxyl group and a cyanoalkyl group, an epoxy compound (B) which has two or more epoxy groups in its molecule, a curing agent (C) which has two or more hydroxyl groups in its molecule and has a hydroxyl value of 150 to 300 mgKOH/g, and a cross-linking agent (D) which has a structure represented by the general formula (1). ##STR00001## (In the general formula (1), R.sup.1 and R.sup.2 are C.sub.1 to C.sub.20 alkyl groups, where R.sup.1 and R.sup.2 may be the same as each other or different from each other.)

THERMALLY CONDUCTIVE COMPOSITION

A thermally conductive composition includes (A) polyamide-imide, (B) epoxy resin, (C) curing agent, (D) filler, and (E) benzene-containing silane, in which (A) polyamide-imide has a chemical structure of

##STR00001##

wherein X.sub.1 is

##STR00002##

X.sub.2

##STR00003##

m=60 to 80, n=10 to 30, and o=10 to 30.

RUBBER COMPOSITION CONTAINING A DIENE ELASTOMER HAVING CARBONATE FUNCTIONAL GROUPS

A rubber composition contains at least: a reinforcing filler comprising silica, an elastomer comprising units of a 1,3-diene monomer and bearing carbonate functions that are each present in a 1,3-dioxolan-2-one ring, a crosslinking system comprising a polyamine compound, and a terpene phenolic resin.

CURABLE RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

The first curable resin composition contains a triphenylmethane epoxy resin having at least one selected from the group consisting of alkyl groups and alkoxy groups. The second curable resin composition contains a polysiloxane stress reliever and a triphenylmethane epoxy resin having at least one selected from the group consisting of alkyl groups and alkoxy groups. The third curable resin composition, when made into a cured product, has an elastic modulus at 260 C. of 400 MPa or less, a linear expansion coefficient at 180-200 C. of 32 ppm/ C. or more, and an adhesive strength of the cured product to Ag (silver) after treatment at 85 C. and 85% RH of 0.45 MPa or more.

Rubber composition containing a diene elastomer having carbonate functional groups

A rubber composition contains at least: a reinforcing filler comprising silica, an elastomer comprising units of a 1,3-diene monomer and bearing carbonate functions that are each present in a 1,3-dioxolan-2-one ring, a crosslinking system comprising a polyamine compound, and a terpene phenolic resin.