Patent classifications
C08L2314/08
SILICONE MATERIAL, SILICONE TUBE, IMPLANT, PHARMACEUTICAL COMPOSITION, AND TEST METHOD FOR AMOUNT OF DRUG RELEASED
Disclosed are a silicone material, a silicone tube, an implant, a pharmaceutical composition, and a test method for the amount of a drug released. a raw material composition of the silicone material comprises the following components in parts by weight: 100 parts of R-vinyl silicone rubber; 20-80 parts of a reinforcing agent; 0.3-3.0 parts of hydrogen-containing silicone oil; and 0.000002 parts of a catalyst, preferably being 0.000002-0.00005 parts; the content of vinyl groups in the R-vinyl silicone rubber is 0.10-0.50 mol %; the content of SiH groups in the hydrogen-containing silicone oil is 0.18-1.6 mol %; the molar ratio of the SiH groups in the hydrogen-containing silicone oil to the vinyl groups in the R-vinyl silicone rubber is (0.5-4):1; and optionally, said material further comprises an inhibitor. A silicone tube prepared by the silicone material has an excellent mechanical property and good biocompatibility; and an implant made from the silicone tube, upon loading with an active drug, has a stable drug release curve.
GOLF BALL
An object of the present disclosure is to provide a golf ball having excellent impact durability and excellent flight distance performance. The present disclosure provides a golf ball comprising a constituent member, wherein at least one part of the constituent member is formed of a cured product of a rubber composition containing (a) a base rubber, (b) a co-crosslinking agent and (c) a crosslinking initiator, (a) the base rubber includes (a1) a polybutadiene synthesized by using a cobalt-based catalyst and (a2) a natural rubber, (b) the co-crosslinking agent includes an unsaturated carboxylic acid and/or a metal salt thereof, and (c) the crosslinking initiator includes an organic peroxide.
THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER
A thermally conductive composition comprising: (A) an organopolysiloxane having two or more alkenyl groups; (B) an organo-hydrogen polysiloxane having two hydrosilyl groups; (C) an organo-hydrogen polysiloxane having three or more hydrosilyl groups; (D) an organopolysiloxane having one alkenyl or methacryloyl group; (E) a thermally conductive filler; and (F) a platinum group metal-based curing catalyst, wherein the ratio of a Raman intensity p1 at 2160 cm.sup.1 and a Raman intensity p2 at 2130 cm.sup.1 in a Raman spectroscopy spectrum, p2/p1, is larger than 3.00 and a type E hardness E2 after the composition is left to stand at 25 C. for 24 hours and further at 150 C. for 250 hours is less than 70.
SILICONE FOAM-FORMING COMPOSITIONS AND SILICONE FOAMS MADE THEREFROM
Silicone foam-forming compositions are disclosed that enable the production of silicone foams having densities <3 lbs/ft.sup.3 and as low as 2.0 lbs/ft.sup.3 or lower. The compositions comprise methyl hydrogen siloxane, one or more silanols that react with the methyl hydrogen siloxane in the presence of a platinum group catalyst, a long chain alcohol having between 5 and 12 carbon atoms, and starch. The silicone foams resulting from the foam-forming compositions are mechanically stable (non-friable) and do not collapse.
High thermal conductive silicone composition
A high thermal conductive silicone composition including: (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and a kinematic viscosity at 25 C of 100 to 100,000 mm.sup.2/s; (B) an aluminum powder having an average particle size of 50 m or more; (C) a thermal conductive filler having an average particle size of 0.1 to less than 50 m; (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom (SiH groups) in one molecule; (E) a hydrolyzable organopolysiloxane represented by the following general formula (1); and (F) a platinum group metal catalyst having an effective amount. The high thermal conductive silicone composition can conform to the warpage of a substrate due to an increased material thickness and can maintain heat dissipation performance due to a high thermal conductivity. ##STR00001##
Linear low density polyethylene for film applications
The present disclosure generally relates to catalyst systems, polyethylene compositions, and uses of such compositions in, e.g., films. In an embodiment is provided a film that includes a polyethylene composition, comprising: ethylene and a C.sub.3-C.sub.40 olefin comonomer, the polyethylene composition having at least 75 wt % ethylene content and from 0 wt % to 25 wt % of a C.sub.3-C.sub.40 olefin comonomer content based upon the total weight of the composition as determined by GPC-IR5-LS-VIS, the film having: an average of MD and TD 1% secant modulus of 42,000 psi or greater as determined by ASTM D-882, and a Dart Drop Impact of greater than 400 g/mil, as determined by ASTM D1709. In another embodiment is provided a process for producing a polyethylene composition, comprising: introducing, under first polymerization conditions, ethylene and a C.sub.3-C.sub.40 alpha-olefin to a catalyst system in a reactor, the catalyst system comprising a first catalyst compound, a second catalyst compound, and an activator; and forming a polyethylene composition.