A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.

A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.

A method for depositing a conductive coating on a surface is provided, the method including treating the surface by depositing fullerene on the surface to produce a treated surface and depositing the conductive coating on the treated surface. The conductive coating generally includes magnesium. A product and an organic optoelectronic device produced according to the method are also provided.

A method for depositing a conductive coating on a surface is provided, the method including treating the surface by depositing fullerene on the surface to produce a treated surface and depositing the conductive coating on the treated surface. The conductive coating generally includes magnesium. A product and an organic optoelectronic device produced according to the method are also provided.

The present disclosure relates to electrical windings for a dry transformer which allows construction of a compact dry transformer even in relatively high voltage classes. For this purpose, the electrical winding has multiple windings of a winding conductor wound to form a coil. The coil has been embedded into a solid insulation body. In some embodiments, a coating of an electrically conductive material, comprising a resin matrix with at least 0.05% by weight of nanoscale filler, has been applied to at least one surface of the insulation body.

A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

A saltwater corrosion resistant composite coating is described. The coating includes at least one conductive polymer, chitosan, reduced graphene oxide (rGO), and a cured epoxy. The rGO and chitosan are dispersed in particles of the conductive polymer to form a 3D network. At least a portion of the chitosan is covalently bound to the rGO. At least a portion of the conductive polymer is covalently bound to the chitosan, and the 3D network is dispersed in the cured epoxy.

A saltwater corrosion resistant composite coating is described. The coating includes at least one conductive polymer, chitosan, reduced graphene oxide (rGO), and a cured epoxy. The rGO and chitosan are dispersed in particles of the conductive polymer to form a 3D network. At least a portion of the chitosan is covalently bound to the rGO. At least a portion of the conductive polymer is covalently bound to the chitosan, and the 3D network is dispersed in the cured epoxy.

A coating for a substrate includes a first portion and a second portion. The first portion includes a first liquid silicone rubber, carbon nanotubes at a concentration of at least about 0.5% by weight of the first portion, and at least one ferrite-containing component chosen from carbon ferrite and nickel manganese ferrite. The second portion includes a second liquid silicone rubber, carbon nanotubes at a concentration of at least about 0.5% by weight of the second portion, and at least one ferrite-containing component chosen from carbon ferrite and nickel manganese ferrite. Methods of producing the coating are also disclosed.