Patent classifications
C09D5/34
AUTOBODY REPAIR FORMULATION WITH IMPROVED CONTROL OF WORK TIME AND CURE TIME AT EXTREME AMBIENT AIR TEMPERATURES
An Additive Package is provided to adjust the cure properties of a two-part bonding filler across a temperature range of from 4 and 44 degrees Celsius. A low temperature additive speeds a cure rate between 4 and 15 degrees Celsius and a high temperature additive slows down a cure rate between 25 and 44 degrees Celsius. The amount of Additive Package is varied to account for the desired cure properties. The Additive Package includes a first unsaturated polyester resins with an average degree of unsaturation of 70-100 percent based on total acid and anhydride monomer content. A process for repairing a vehicle body is provided using the Additive Package. A kit for accomplishing repairs in an after-market repair setting is also provided.
AUTOBODY REPAIR FORMULATION WITH IMPROVED CONTROL OF WORK TIME AND CURE TIME AT EXTREME AMBIENT AIR TEMPERATURES
An Additive Package is provided to adjust the cure properties of a two-part bonding filler across a temperature range of from 4 and 44 degrees Celsius. A low temperature additive speeds a cure rate between 4 and 15 degrees Celsius and a high temperature additive slows down a cure rate between 25 and 44 degrees Celsius. The amount of Additive Package is varied to account for the desired cure properties. The Additive Package includes a first unsaturated polyester resins with an average degree of unsaturation of 70-100 percent based on total acid and anhydride monomer content. A process for repairing a vehicle body is provided using the Additive Package. A kit for accomplishing repairs in an after-market repair setting is also provided.
Two-component putty, method for coating a substrate with such putty, substrates coated with such putty
The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: castor oil as resin component; and a further resin component having a hydroxyl number in the range of from 00 to 800 mg KOH/g, wherein the curing component comprises a polyisocyanate, and wherein the two-component putty further comprises hollow microspheres and an organically modified inorganic filler. The present invention also relates to a method for coating a substrate by applying such putty and allowing the applied putty to cure. The invention further relates to a coated substrate obtainable by such method.
Two-component putty, method for coating a substrate with such putty, substrates coated with such putty
The present invention relates to a two-component putty comprising (1) a base component and (2) a curing component, wherein the base component comprises: castor oil as resin component; and a further resin component having a hydroxyl number in the range of from 00 to 800 mg KOH/g, wherein the curing component comprises a polyisocyanate, and wherein the two-component putty further comprises hollow microspheres and an organically modified inorganic filler. The present invention also relates to a method for coating a substrate by applying such putty and allowing the applied putty to cure. The invention further relates to a coated substrate obtainable by such method.
Low-Dust Products Using Microcrystalline Wax Emulsion
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.
Low-Dust Products Using Microcrystalline Wax Emulsion
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.
COATING AGENT, PROCESS OF FORMING COATING FILMS, PRIMER TREATMENT PROCESS, PROCESS OF REPAIRING CONCRETES, AND PROCESS OF CONSTRUCTING ROADS
A coating agent is capable of forming a coating film that has enhanced adhesion and adherence to a substrate, and enhanced water resistance as well and composed mainly of an aqueous material. A process of forming a coating agent uses the coating agent, a primer treatment process uses the coating agent, a process of doing repairs to concretes uses the coating agent, and a process of laying down roads uses the coating agent. The coating agent is composed mainly of a polyphenol derivative and containing a polymerizing agent, and has a pH of 9 or less. The polymerizing agent contains a compound having two or more functional groups selected from the group of an amino group and a mercapto group per molecule. In the process of forming a coating film, the coating agent is applied onto a substrate in an alkaline environment having a pH of greater than 9.
Low Dust Additives Comprising Emulsified Powder For Joint Compounds And Joint Compounds Thereof
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive is a powder prepared from colloidally-protected, wax-based microstructure dispersions.
Low Dust Additives Comprising Emulsified Powder For Joint Compounds And Joint Compounds Thereof
The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive is a powder prepared from colloidally-protected, wax-based microstructure dispersions.
Water-Resistant Exterior Joint Compounds
Embodiments of the present disclosure are directed to joint compounds for sealing exterior sheathing wallboards applied on the exterior of buildings. This invention also relates to a process of preparing such exterior joint compounds. The joint compounds of this invention comprise an aqueous emulsion system and provide water resistance comparable to the substrate on which they are applied, that is, the exterior sheathing wallboards.