The method includes applying a curable sealant to a surface of the aircraft component, forming a non-tacky skin on an exposed portion of the curable sealant within a first time period while allowing a portion of the curable sealant adjacent the surface of the aircraft component to be liquid for a second time period. The second time period is at least twice the first time period. The curable sealant comprises at least one of an adhesion promoter or a wetting agent.

A curable composition for production of coatings for thermal, electrical and/or acoustic insulation, where the composition has at least one aqueous binder can be made. The composition has a first component based on spray-dried fumed silica pellets. The composition also has at least one second component selected from the group of the silicon dioxides, preferably microsilica, pellets based on pyrogenically produced silicon dioxide, silica aerogels, silicate glass (foamed glass/expanded glass), hollow silicon dioxide particles (hollow glass beads), or pellets selected from perlites, preferably expanded perlites, vermiculites, polymers, preferably expanded polystyrene pellets, and mixtures thereof.

A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimide composition made of diamine monomer and tetracarboxylic dianhydride monomer. The polyimide layer further includes a cross-linker and an initiator. The diamine monomer is an aliphatic diamine monomer with a number of carbon greater than or equal to 36. A lowest viscosity of the polyimide layer is less than 20000 Pa.Math.s when polyimide layer is under a temperature in a range of 60 C. to 160 C.

A cover film includes a release layer and a polyimide layer disposed on the release layer. The polyimide layer includes an inner surface and an outer surface opposite to the inner surface. The outer surface is exposed to the atmosphere, and the polyimide layer is formed from a reaction of a polyimide composition made of diamine monomer and tetracarboxylic dianhydride monomer. The polyimide layer further includes a cross-linker and an initiator. The diamine monomer is an aliphatic diamine monomer with a number of carbon greater than or equal to 36. A lowest viscosity of the polyimide layer is less than 20000 Pa.Math.s when polyimide layer is under a temperature in a range of 60 C. to 160 C.

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reducing additive that reduces the quantity of airborne dust generated when the hardened compound is sanded. The dust reducing additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reducing additive comprises microcrystalline-wax based emulsion.

A self-healing polymer is described herein, including a first carbon nanotube filled with at least a first healing agent, wherein the first carbon nanotube has first and second ends, wherein a first end cap is closed on the first end of the first carbon nanotube and a second end cap is closed on the second end of the first carbon nanotube, and a second carbon nanotube filled with at least a second healing agent, wherein the second carbon nanotube has first and second ends, wherein a first end cap is closed on the first end of the second carbon nanotube and a second end cap is closed on the second end of the second carbon nanotube.

A self-healing polymer is described herein, including a first carbon nanotube filled with at least a first healing agent, wherein the first carbon nanotube has first and second ends, wherein a first end cap is closed on the first end of the first carbon nanotube and a second end cap is closed on the second end of the first carbon nanotube, and a second carbon nanotube filled with at least a second healing agent, wherein the second carbon nanotube has first and second ends, wherein a first end cap is closed on the first end of the second carbon nanotube and a second end cap is closed on the second end of the second carbon nanotube.

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive is a powder prepared from colloidally-protected, wax-based microstructure dispersions.

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive is a powder prepared from colloidally-protected, wax-based microstructure dispersions.