C09D5/34

Plasticizer free caulks and sealants comprising waterborne acrylic polymeric composites and methods for making the same

The present invention provides aqueous caulk or sealant compositions that are substantially free of any plasticizer comprising an aqueous emulsion copolymer having a broad measured glass transition temperature by differential scanning calorimetry (DSC), soft phases and hard phases, and two separate Tan Delta transition temperatures as measured by dimensional mechanical analysis (DMA), (ii) one or more filler in a filler to binder ratio of up to 4:1, and (iii) from 0.2 to 5 wt. % as solids, based on the total weight of the composition, of one or more thickener or rheology modifier. In addition, the invention provides methods of making the composition comprising polymerizing by gradually adding from a flask into a polymerization vessel a soft monomer composition, and, after feeding at least 20 wt. % of such composition in the vessel, gradually adding into the flask a hard comonomer composition, feeding all flask contents into the vessel and polymerizing.

Plasticizer free caulks and sealants comprising waterborne acrylic polymeric composites and methods for making the same

The present invention provides aqueous caulk or sealant compositions that are substantially free of any plasticizer comprising an aqueous emulsion copolymer having a broad measured glass transition temperature by differential scanning calorimetry (DSC), soft phases and hard phases, and two separate Tan Delta transition temperatures as measured by dimensional mechanical analysis (DMA), (ii) one or more filler in a filler to binder ratio of up to 4:1, and (iii) from 0.2 to 5 wt. % as solids, based on the total weight of the composition, of one or more thickener or rheology modifier. In addition, the invention provides methods of making the composition comprising polymerizing by gradually adding from a flask into a polymerization vessel a soft monomer composition, and, after feeding at least 20 wt. % of such composition in the vessel, gradually adding into the flask a hard comonomer composition, feeding all flask contents into the vessel and polymerizing.

PUMPABLE, THERMALLY EXPANDABLE PREPARATION
20220033660 · 2022-02-03 ·

The present application relates to a preparation that is pumpable, thermally curable and expandable at application temperatures, typically in the range of 30 to 120° C., and contains at least one solid rubber, at least one liquid rubber, at least one thermally activatable blowing agent and a curing agent system containing at least one peroxide and at least one quinone, quinone dioxime or dinitrosobenzene, to a method for stiffening structural components having thin-walled structures using such preparations or for sealing cavities in structural components using such preparations, and to the use of these preparations for stiffening such structures or for sealing cavities in structural components.

PUMPABLE, THERMALLY EXPANDABLE PREPARATION
20220033660 · 2022-02-03 ·

The present application relates to a preparation that is pumpable, thermally curable and expandable at application temperatures, typically in the range of 30 to 120° C., and contains at least one solid rubber, at least one liquid rubber, at least one thermally activatable blowing agent and a curing agent system containing at least one peroxide and at least one quinone, quinone dioxime or dinitrosobenzene, to a method for stiffening structural components having thin-walled structures using such preparations or for sealing cavities in structural components using such preparations, and to the use of these preparations for stiffening such structures or for sealing cavities in structural components.

REMOVABLE, AQUEOUS-BASED COMPOSITIONS
20170226348 · 2017-08-10 ·

Removable, aqueous-based compositions, especially sealants useful for, inter alia, temporary craft applications and seasonal weatherization of buildings and methods of their use are disclosed. These sealants reduce the flammability risks and lingering odor problems associated using solvent-based systems, particularly during application. These compositions do not rely on additives that disrupt the adhesion of the compositions to the substrate and that leave undesirable residue on the substrate.

REMOVABLE, AQUEOUS-BASED COMPOSITIONS
20170226348 · 2017-08-10 ·

Removable, aqueous-based compositions, especially sealants useful for, inter alia, temporary craft applications and seasonal weatherization of buildings and methods of their use are disclosed. These sealants reduce the flammability risks and lingering odor problems associated using solvent-based systems, particularly during application. These compositions do not rely on additives that disrupt the adhesion of the compositions to the substrate and that leave undesirable residue on the substrate.

Low Dust Additives Comprising Emulsified Powder For Joint Compounds And Joint Compounds Thereof
20170275479 · 2017-09-28 ·

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive is a powder prepared from colloidally-protected, wax-based microstructure dispersions.

Low Dust Additives Comprising Emulsified Powder For Joint Compounds And Joint Compounds Thereof
20170275479 · 2017-09-28 ·

The present invention relates generally to wall repair compounds such as joint compounds, spackling compounds, and the like used to repair imperfections in walls or fill joints between adjacent wallboard panels. Particularly, the present invention relates to such a wall repair compound comprising a dust reduction additive that reduces the quantity of airborne dust generated when the hardened compound is sanded and also exhibits improved adhesive properties. The dust reduction additive also imparts adhesion to the wall repair compounds to which it is added, for example to a joint compound. The dust reduction additive is a powder prepared from colloidally-protected, wax-based microstructure dispersions.

Metal paste for gas sensor electrode formation

To be provided is a metal paste from which an electrode having high electrode activity as a sensor electrode of various gas sensors can be produced. The present invention is a metal paste for forming a gas sensor electrode obtained by dispersing a conductive particle including Pt or a Pt alloy and a ceramic powder including zirconia or stabilized zirconia, or any of zirconia and stabilized zirconia and one or more oxides of La, Ce, Pr, Nd, Sm, and Hf in a solvent, the metal paste further including an inorganic oxide particle containing alumina and an insoluble particle that is insoluble in the solvent, in which 0.5 or more to 3.0 mass % or less of the inorganic oxide particle and 1.0 to 5.0 mass % of the insoluble particle are dispersed based on the mass of the solid content of the conductive particle, the ceramic powder, the inorganic oxide particle, and the insoluble particle.

Metal paste for gas sensor electrode formation

To be provided is a metal paste from which an electrode having high electrode activity as a sensor electrode of various gas sensors can be produced. The present invention is a metal paste for forming a gas sensor electrode obtained by dispersing a conductive particle including Pt or a Pt alloy and a ceramic powder including zirconia or stabilized zirconia, or any of zirconia and stabilized zirconia and one or more oxides of La, Ce, Pr, Nd, Sm, and Hf in a solvent, the metal paste further including an inorganic oxide particle containing alumina and an insoluble particle that is insoluble in the solvent, in which 0.5 or more to 3.0 mass % or less of the inorganic oxide particle and 1.0 to 5.0 mass % of the insoluble particle are dispersed based on the mass of the solid content of the conductive particle, the ceramic powder, the inorganic oxide particle, and the insoluble particle.