Disclosed is a heat curable solvent free plastisol composition that exhibits very low volatile organic compound amounts while maintaining high performance characteristics. The present plastisol compositions have solvent substitutes used at amounts up to 15% by weight based on the total composition weight. The solvent substitutes have very low vapor pressures, stable viscosity effects, and are fusible with the plastisol polymers. These solvent substitutes can be used to replace the typical solvents without requiring extensive re-formulation of the plastisol composition. The final plastisol compositions according to the present invention exhibit low VOC measures of less than 0.03 pounds per gallon when measured according to EPA Method 24.

Described herein are silane-based coating compositions, particularly clearcoat compositions, including a metal alkoxide catalyst. Also described herein are silane-based coating compositions, particularly clearcoat compositions, including a silane-based compound having two different alkoxysilane moieties. Further, described herein are a method of coating substrates with such coating compositions and coated substrates obtained by said method. Finally, described herein are multilayer coatings and substrates coated with said multilayer coatings.

Described herein are silane-based coating compositions, particularly clearcoat compositions, including a metal alkoxide catalyst. Also described herein are silane-based coating compositions, particularly clearcoat compositions, including a silane-based compound having two different alkoxysilane moieties. Further, described herein are a method of coating substrates with such coating compositions and coated substrates obtained by said method. Finally, described herein are multilayer coatings and substrates coated with said multilayer coatings.

A low volatile organic compound (VOC) coating composition with a low viscosity is described. The coating composition includes a hydrocarbon solvent; a reactive or non-reactive diluent; a drier composition; and a hyper-branched alkylated polymer. A colorant can be added so that the coating composition can be used as a stain, such as a wood stain. The hyper-branched alkylated polymer functions as the main binder to provide an effective coating composition having a relatively low VOC level.

A low volatile organic compound (VOC) coating composition with a low viscosity is described. The coating composition includes a hydrocarbon solvent; a reactive or non-reactive diluent; a drier composition; and a hyper-branched alkylated polymer. A colorant can be added so that the coating composition can be used as a stain, such as a wood stain. The hyper-branched alkylated polymer functions as the main binder to provide an effective coating composition having a relatively low VOC level.

A membrane-forming composition containing a silicone, a silicone-dissolving solvent, surface-modified microparticles, and a particular solvent which is a compound having one or more oxygen or one or more nitrogen atoms and which has a dielectric constant of 1 to 30.

A membrane-forming composition containing a silicone, a silicone-dissolving solvent, surface-modified microparticles, and a particular solvent which is a compound having one or more oxygen or one or more nitrogen atoms and which has a dielectric constant of 1 to 30.

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).

A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.