An assembly for removing a desired portion of one or more layers of paint or another coating from a designated area is provided including a pad soaked with a chemical paint remover and an adhesive layer arranged about the pad configured to couple the assembly to the designated area. A removable first protective layer is positioned upwardly adjacent and is coupled to the adhesive layer. A flexible support layer is positioned adjacent the adhesive layer and the pad, opposite the removable first protective layer. A heat pad is arranged downwardly adjacent the flexible support layer. The heat pad is configured to control a microclimate adjacent the assembly when activated. A removable second protective layer is coupled to a surface of the heat pad. Removal of the second protective layer activates the heat pad.

An assembly for removing a desired portion of one or more layers of paint or another coating from a designated area is provided including a pad soaked with a chemical paint remover and an adhesive layer arranged about the pad configured to couple the assembly to the designated area. A removable first protective layer is positioned upwardly adjacent and is coupled to the adhesive layer. A flexible support layer is positioned adjacent the adhesive layer and the pad, opposite the removable first protective layer. A heat pad is arranged downwardly adjacent the flexible support layer. The heat pad is configured to control a microclimate adjacent the assembly when activated. A removable second protective layer is coupled to a surface of the heat pad. Removal of the second protective layer activates the heat pad.

Disclosed is a liquid mixture (preferably an oil-in-water emulsion) for cleaning spilled paint, varnish, dye and/or surface coating, and a cleaning method comprising a step of applying said mixture to a fresh stain left by paint, varnish, surface coating and/or dye.

Disclosed is a liquid mixture (preferably an oil-in-water emulsion) for cleaning spilled paint, varnish, dye and/or surface coating, and a cleaning method comprising a step of applying said mixture to a fresh stain left by paint, varnish, surface coating and/or dye.

The present disclosure provides a floor care system that includes an abrasive pad, a floor finish composition, and a remover solution. The floor finish composition typically comprises at least one polymer emulsion, a first alkali soluble resin, a second alkali soluble resin, at least one plasticizer, and at least one solvent. The remover solution typically comprises at least one organic functional amine selected from a branched or unbranched amino-alkoxy-alkanol moiety, and at least one surfactant. The at least one organic functional amine typically comprises 50% to 80% by weight of the remover solution.

To achieve efficient stripping of organic coatings from sensitive substrate without affecting the substrate surface, a novel non-aqueous stripping composition and method are provided. The stripping composition comprises: A. at least one high-boiling solvent selected from the group, consisting of alcohols having general chemical formula ROH, wherein R is a C.sub.4-C.sub.30 hydrocarbon group, wherein the high-boiling solvent has a boiling point of at least 100 C.; B at least one high-boiling co-solvent selected from the group, consisting of high-boiling glycols, glycol ethers and amine compounds, wherein the high-boiling co-solvent has a boiling point of at least 100 C.; and C at least one pH-active agent either selected from the group, consisting of acid compounds or selected from the group, consisting of hydroxide compounds.

To achieve efficient stripping of organic coatings from sensitive substrate without affecting the substrate surface, a novel non-aqueous stripping composition and method are provided. The stripping composition comprises: A. at least one high-boiling solvent selected from the group, consisting of alcohols having general chemical formula ROH, wherein R is a C.sub.4-C.sub.30 hydrocarbon group, wherein the high-boiling solvent has a boiling point of at least 100 C.; B at least one high-boiling co-solvent selected from the group, consisting of high-boiling glycols, glycol ethers and amine compounds, wherein the high-boiling co-solvent has a boiling point of at least 100 C.; and C at least one pH-active agent either selected from the group, consisting of acid compounds or selected from the group, consisting of hydroxide compounds.

A method for cleaning a semiconductor substrate includes peeling and dissolving an adhesive layer formed on a semiconductor substrate using a peeling and dissolving composition, in which the peeling and dissolving composition contains: a component [I]: a quaternary ammonium salt; a component [II]: an amide-based solvent; and a component [III]: a solvent represented by the following Formula (L):

L.sup.1-L.sup.3-L.sup.2(L)

where L.sup.1 and L.sup.2 each independently represents an alkyl group having 2 to 5 carbon atoms, and L.sup.3 represents O or S.

The invention provides a deinking method including a step of peeling off and removing, from a plastic substrate having an ink layer, the ink layer by using a deinking agent that contains (a) 20 mass % or more of a water-soluble solvent and (b) 0.1 mass % to 10 mass % of an inorganic base. According to the invention, it is possible to provide a deinking method that can easily peel off an ink layer printed on a plastic substrate, a deinking agent that can be used in the deinking method, and a plastic substrate recovery method using the same.

The invention provides a deinking method including a step of peeling off and removing, from a plastic substrate having an ink layer, the ink layer by using a deinking agent that contains (a) 20 mass % or more of a water-soluble solvent and (b) 0.1 mass % to 10 mass % of an inorganic base. According to the invention, it is possible to provide a deinking method that can easily peel off an ink layer printed on a plastic substrate, a deinking agent that can be used in the deinking method, and a plastic substrate recovery method using the same.