A composition for manufacturing an organic electronic device includes at least three organic functional materials H1, H2, and H3, and at least one organic solvent. The organic functional materials H1 and H2 can form a type II semiconductor heterojunction structure. A LUMO value of the organic functional material H3 is greater than or equal to that of the organic functional materials H1 and H2, and a HOMO value thereof is less than or equal to that of the organic functional materials H1 and H2.

A conductive ink is provided, which includes an ink solvent and a conductive composition dispersed in the ink solvent. The conductive composition includes a silver nanoparticle and a molecular chain of polyaniline formed on a surface of the silver nanoparticle. A method for preparing a conductive ink and a flexible display device are further provided. The conductive ink has good film forming property and good conductivity.

A conductive ink is provided, which includes an ink solvent and a conductive composition dispersed in the ink solvent. The conductive composition includes a silver nanoparticle and a molecular chain of polyaniline formed on a surface of the silver nanoparticle. A method for preparing a conductive ink and a flexible display device are further provided. The conductive ink has good film forming property and good conductivity.

An ink film construction consisting: (a) a printing substrate; and (b) at least one ink film, fixedly adhered to a top surface of the printing substrate, the ink film having an upper film surface distal to the top surface of the substrate, wherein a surface concentration of nitrogen at the upper film surface exceeds a bulk concentration of nitrogen within the film, the bulk concentration measured at a depth of at least 30 nanometers below the upper film surface, and wherein a ratio of the surface concentration to the bulk concentration is at least 1.1 to 1.

An ink film construction consisting: (a) a printing substrate; and (b) at least one ink film, fixedly adhered to a top surface of the printing substrate, the ink film having an upper film surface distal to the top surface of the substrate, wherein a surface concentration of nitrogen at the upper film surface exceeds a bulk concentration of nitrogen within the film, the bulk concentration measured at a depth of at least 30 nanometers below the upper film surface, and wherein a ratio of the surface concentration to the bulk concentration is at least 1.1 to 1.

The present invention relates to the technical field of security documents comprising a security feature, such as a windowed security thread, a security foil, a security patch, a hologram or an ink printed security feature, and a protective coating, and methods of manufacturing of said security documents. The security feature has a security feature thickness t.sub.f of at least about 5 μm (micrometers) and a security feature surface facing away from the substrate consisting of a first region adjacent to the edges of the security feature and a second region non-adjacent to the edges of the security feature. The protective coating covers the security feature surface facing away from the substrate, a first substrate surface adjacent to the edges of the security feature, and a second substrate surface, which is different from the substrate surface covered by the security feature and the first substrate surface. The protective coating covering the security feature surface facing away from the substrate and the first substrate surface is transparent, the protective coating covering the first region has a thickness t.sub.b1, the protective coating covering the second region has a thickness t.sub.b2, the protective coating covering the first substrate surface has a thickness t.sub.c, and the protective coating covering the second substrate surface has a thickness t.sub.a. The thickness t.sub.c is larger than the thickness t.sub.f, which is larger than the thickness t.sub.a; the thickness t.sub.b2 is larger than the thickness t.sub.a; and either the thickness t.sub.c is larger than the thickness t.sub.b1, which is larger than or equal to the thickness t.sub.b2; or the thickness t.sub.c is equal to the thickness t.sub.b1, which is larger than the thickness t.sub.b2. The variable protective coating thickness on the surface of the security document provides the inventive security document with an increased resistance against physical and chemical attacks from the environment, while maintaining the mechanical resistance properties required for such security documents.

The present invention relates to the technical field of security documents comprising a security feature, such as a windowed security thread, a security foil, a security patch, a hologram or an ink printed security feature, and a protective coating, and methods of manufacturing of said security documents. The security feature has a security feature thickness t.sub.f of at least about 5 μm (micrometers) and a security feature surface facing away from the substrate consisting of a first region adjacent to the edges of the security feature and a second region non-adjacent to the edges of the security feature. The protective coating covers the security feature surface facing away from the substrate, a first substrate surface adjacent to the edges of the security feature, and a second substrate surface, which is different from the substrate surface covered by the security feature and the first substrate surface. The protective coating covering the security feature surface facing away from the substrate and the first substrate surface is transparent, the protective coating covering the first region has a thickness t.sub.b1, the protective coating covering the second region has a thickness t.sub.b2, the protective coating covering the first substrate surface has a thickness t.sub.c, and the protective coating covering the second substrate surface has a thickness t.sub.a. The thickness t.sub.c is larger than the thickness t.sub.f, which is larger than the thickness t.sub.a; the thickness t.sub.b2 is larger than the thickness t.sub.a; and either the thickness t.sub.c is larger than the thickness t.sub.b1, which is larger than or equal to the thickness t.sub.b2; or the thickness t.sub.c is equal to the thickness t.sub.b1, which is larger than the thickness t.sub.b2. The variable protective coating thickness on the surface of the security document provides the inventive security document with an increased resistance against physical and chemical attacks from the environment, while maintaining the mechanical resistance properties required for such security documents.

The present invention relates to poly(aryl ether) polymers which can for example be used in lithographic processes for the photofabrication of three-dimensional (3D) articles. The invention further relates to compositions including these poly(aryl ether) polymers. Still further, the invention relates to lithographic methods to form 3D articles or objects that incorporate the aforementioned polymer compositions.

The present invention relates to polyetherimide polymers which can for example be used in lithographic processes for the photofabrication of three-dimensional (3D) articles. The invention further relates to compositions including these polyetherimide polymers. Still further, the invention relates to lithographic methods to form 3D articles or objects that incorporate the aforementioned polymer compositions.

An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.