An object of the present invention is to provide an ink composition for manufacturing an organic semiconductor device, the ink composition allowing an organic semiconductor material with a rigid main chain into an ink having an optimal solute concentration for a single-crystal formation process. The present invention provides an ink composition for manufacturing an organic semiconductor device, the ink composition including at least one solvent selected from Naphthalene Compound (A) and at least one solute. The isomer content of Naphthalene Compound (A) is preferably 2% or less in terms of a percentage for peak area with Naphthalene Compound (A) being 100% in gas chromatography. Naphthalene Compound (A): a compound represented by Formula (a), where in Formula (a), R is as defined in the description.

A method to manufacture an article comprises applying an ink to a substrate. The ink includes a liquid vehicle, a plurality of solid metal particles, a plurality of gallium-containing particles, and a thermally activated flux. The method further comprises curing the ink by heating the substrate to within an activation temperature range of the flux. The article manufactured by this method comprises a substrate, an electronically conductive film arranged on the substrate, and an adherent barrier layer covering both the substrate and the film. The film includes a plurality of solid metal particles with a gallium-based liquid metal bridging the plurality of solid metal particles.

A method to manufacture an article comprises applying an ink to a substrate. The ink includes a liquid vehicle, a plurality of solid metal particles, a plurality of gallium-containing particles, and a thermally activated flux. The method further comprises curing the ink by heating the substrate to within an activation temperature range of the flux. The article manufactured by this method comprises a substrate, an electronically conductive film arranged on the substrate, and an adherent barrier layer covering both the substrate and the film. The film includes a plurality of solid metal particles with a gallium-based liquid metal bridging the plurality of solid metal particles.

The present disclosure relates to a conductive aqueous ink composition for screen printing, a conductive pattern manufactured using the same, and a conductive device comprising the same, wherein the ink composition is applicable to plastic bases and the like through low-temperature firing and can serve as an aqueous ink to improve a working environment. More specifically, a conductive aqueous ink composition for screen printing, a conductive pattern manufactured using the same, and a conductive device comprising the same are disclosed wherein the ink composition comprises: metal nanoparticles (A) protected by a dispersion stabilizer and having a particle size in the range of 5 to 50 nm; and a water-soluble solvent (B), the dispersion stabilizer containing: a protective polymer composed of branched polyalkylene imine segments and polyoxyalkylene segments; and an amine acid salt composed of an amine and an inorganic acid.

The present disclosure relates to a conductive aqueous ink composition for screen printing, a conductive pattern manufactured using the same, and a conductive device comprising the same, wherein the ink composition is applicable to plastic bases and the like through low-temperature firing and can serve as an aqueous ink to improve a working environment. More specifically, a conductive aqueous ink composition for screen printing, a conductive pattern manufactured using the same, and a conductive device comprising the same are disclosed wherein the ink composition comprises: metal nanoparticles (A) protected by a dispersion stabilizer and having a particle size in the range of 5 to 50 nm; and a water-soluble solvent (B), the dispersion stabilizer containing: a protective polymer composed of branched polyalkylene imine segments and polyoxyalkylene segments; and an amine acid salt composed of an amine and an inorganic acid.

A dielectric ink composition includes an epoxy precursor and a photoacid generator. The dielectric ink composition is aerosolable and ultraviolet (UV) curable.

A method of fabricating a three-dimensional (3D) object includes atomizing a pre-polymer composition into an aerosol jet stream. The pre-polymer composition includes an epoxy precursor and a photoacid generator. The method further includes depositing the aerosol jet stream onto a substrate to form a first layer of dielectric ink and curing the first layer of dielectric ink using ultraviolet (UV) light. The method further includes depositing the aerosol jet stream onto the first layer of dielectric ink to form a second layer of dielectric ink. The first layer of dielectric ink and the second layer of dielectric ink overlap by at least 50%.

A method of fabricating a three-dimensional (3D) object includes atomizing a pre-polymer composition into an aerosol jet stream. The pre-polymer composition includes an epoxy precursor and a photoacid generator. The method further includes depositing the aerosol jet stream onto a substrate to form a first layer of dielectric ink and curing the first layer of dielectric ink using ultraviolet (UV) light. The method further includes depositing the aerosol jet stream onto the first layer of dielectric ink to form a second layer of dielectric ink. The first layer of dielectric ink and the second layer of dielectric ink overlap by at least 50%.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.