C09D129/02

Compound for forming organic film, and organic film composition using the same, process for forming organic film, and patterning process

The invention provides a compound for forming an organic film having a partial structure represented by the following formula (ii), ##STR00001## wherein the ring structures Ar1, Ar2 and Ar3 each represent a substituted or unsubstituted benzene ring or naphthalene ring; e is 0 or 1; R.sup.0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; L.sub.0 represents a linear, branched or cyclic divalent organic group having 1 to 32 carbon atoms; and the methylene group constituting L.sub.0 may be substituted by an oxygen atom or a carbonyl group. There can be provided an organic film composition for forming an organic film having high dry etching resistance as well as advanced filling/planarizing characteristics.

Compound for forming organic film, and organic film composition using the same, process for forming organic film, and patterning process

The invention provides a compound for forming an organic film having a partial structure represented by the following formula (ii), ##STR00001## wherein the ring structures Ar1, Ar2 and Ar3 each represent a substituted or unsubstituted benzene ring or naphthalene ring; e is 0 or 1; R.sup.0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; L.sub.0 represents a linear, branched or cyclic divalent organic group having 1 to 32 carbon atoms; and the methylene group constituting L.sub.0 may be substituted by an oxygen atom or a carbonyl group. There can be provided an organic film composition for forming an organic film having high dry etching resistance as well as advanced filling/planarizing characteristics.

Compound for forming organic film, and organic film composition using the same, process for forming organic film, and patterning process

The invention provides a compound for forming an organic film having a partial structure represented by the following formula (vii-2), ##STR00001## wherein R.sup.1 represents a linear, branched or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms, and a methylene group constituting R.sup.1 may be substituted by an oxygen atom; a+b is 1, 2 or 3; c and d are each independently 0, 1 or 2; x represents 0 or 1, when x=0, then a=c=0; L.sub.7 represents a linear, branched or cyclic divalent organic group having 1 to 20 carbon atoms, L.sub.8 represents the partial structure represented by the following formula (i), 0o<1, 0<p1 and o+p=1, ##STR00002##
wherein the ring structures Ar3 represent a substituted or unsubstituted benzene ring or naphthalene ring; R.sup.0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; and L.sub.0 represents a divalent organic group. There can be provided an organic film composition for forming an organic film having high dry etching resistance as well as advanced filling/planarizing characteristics.

Compound for forming organic film, and organic film composition using the same, process for forming organic film, and patterning process

The invention provides a compound for forming an organic film having a partial structure represented by the following formula (vii-2), ##STR00001## wherein R.sup.1 represents a linear, branched or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms, and a methylene group constituting R.sup.1 may be substituted by an oxygen atom; a+b is 1, 2 or 3; c and d are each independently 0, 1 or 2; x represents 0 or 1, when x=0, then a=c=0; L.sub.7 represents a linear, branched or cyclic divalent organic group having 1 to 20 carbon atoms, L.sub.8 represents the partial structure represented by the following formula (i), 0o<1, 0<p1 and o+p=1, ##STR00002##
wherein the ring structures Ar3 represent a substituted or unsubstituted benzene ring or naphthalene ring; R.sup.0 represents a hydrogen atom or a linear, branched or cyclic monovalent organic group having 1 to 30 carbon atoms; and L.sub.0 represents a divalent organic group. There can be provided an organic film composition for forming an organic film having high dry etching resistance as well as advanced filling/planarizing characteristics.

HIDING BY USING AIR VOIDS ENCAPSULATED IN HOLLOW GLASS SPHERES

A paint composition with improved hiding power includes water, a film-forming polymer, pigments, and a plurality of hollow glass spheres dispersed in the paint composition. Advantageously, the hollow glass spheres encapsulate air voids in coatings formed from the paint composition.

Inherently printable polymeric material and related methods
09926457 · 2018-03-27 · ·

An inherently printable polymeric material is provided. The polymeric material includes a homogenous mixture of a thermoplastic polymer with a Tg of about 30-80 C., a cyclic olefin copolymer, an ionomer of ethylene and methacrylic acid, and a thermoplastic rubber. The polymeric material can be printed without requiring printing receptive layers or treatments. The polymeric material can be thermoformed, yet retains its printability even after thermoforming.

Inherently printable polymeric material and related methods
09926457 · 2018-03-27 · ·

An inherently printable polymeric material is provided. The polymeric material includes a homogenous mixture of a thermoplastic polymer with a Tg of about 30-80 C., a cyclic olefin copolymer, an ionomer of ethylene and methacrylic acid, and a thermoplastic rubber. The polymeric material can be printed without requiring printing receptive layers or treatments. The polymeric material can be thermoformed, yet retains its printability even after thermoforming.

Planarizing agents and devices

Use of certain materials in hole injection layer and/or hole transport layer can improve operational lifetimes in organic devices. Polymers having fused aromatic side groups such as polyvinylnaphthol polymers can be used in conjunction with conjugated polymers. Inks can be formulated and cast as films in organic electronic devices including OLEDs, SMOLEDs, and PLEDs. One embodiment provides a composition comprising: at least one conjugated polymer, and at least one second polymer different from the conjugated polymer comprising at least one optionally substituted fused aromatic hydrocarbon side group. The substituent can be hydroxyl. Aqueous-based inks can be formulated.

Planarizing agents and devices

Use of certain materials in hole injection layer and/or hole transport layer can improve operational lifetimes in organic devices. Polymers having fused aromatic side groups such as polyvinylnaphthol polymers can be used in conjunction with conjugated polymers. Inks can be formulated and cast as films in organic electronic devices including OLEDs, SMOLEDs, and PLEDs. One embodiment provides a composition comprising: at least one conjugated polymer, and at least one second polymer different from the conjugated polymer comprising at least one optionally substituted fused aromatic hydrocarbon side group. The substituent can be hydroxyl. Aqueous-based inks can be formulated.

Interlayer composition and devices made therefrom

A composition formed from ingredients comprising: an epoxy; a polyvinyl phenol; a cross-linking agent; an epoxy silane; and a solvent is disclosed. A printable medium and other devices made from the composition are also disclosed.