A coating composition includes a (A) binder component and a (B) pigment component. The (A) binder component includes (A1) polyvinyl butyrate, (A2) a particular film forming resin, (A3) an acid, (A4) an optional functionalized tri-alkoxy silane, and (A5) an optional polymeric phosphate ester. The (B) pigment component includes (B1) a calcium ion-exchanged silica, (B2) a corrosion inhibiting pigment, and (B3), a polyalkylene oxide phosphate. The coating composition is formed by combining the aforementioned components. In a method, the coating composition is applied to a substrate.

Techniques and compositions are disclosed for three-dimensional printing with powder/binder systems including, but not limited to, metal injection molding powder materials, highly-filled polymer composites, and any other materials suitable for handling with various additive manufacturing techniques, and further suitable for subsequent debinding and thermal processing into a final object.

A conductive paste is provided for forming conductive traces on substrates. The conductive paste includes a vehicle and conductive material. The vehicle includes a resin, a plasticizer, and a solvent in which the resin is dissolved. After application to a substrate, the conductive paste is cured at ambient temperature by evaporation of the solvent from the paste, to thereby form a conductive trace on the substrate. The conductive trace does not require a curing agent, and attains low resistivity within minutes of application to the substrate.

A conductive paste is provided for forming conductive traces on substrates. The conductive paste includes a vehicle and conductive material. The vehicle includes a resin, a plasticizer, and a solvent in which the resin is dissolved. After application to a substrate, the conductive paste is cured at ambient temperature by evaporation of the solvent from the paste, to thereby form a conductive trace on the substrate. The conductive trace does not require a curing agent, and attains low resistivity within minutes of application to the substrate.

A conductive paste is provided for forming conductive traces on substrates. The conductive paste includes a vehicle and conductive material. The vehicle includes a resin, a plasticizer, and a solvent in which the resin is dissolved. After application to a substrate, the conductive paste is cured at ambient temperature by evaporation of the solvent from the paste, to thereby form a conductive trace on the substrate. The conductive trace does not require a curing agent, and attains low resistivity within minutes of application to the substrate.

Disclosed herein in is a radiative cooling formulation comprising a first component with >55% reflectance in wavelengths between 0.3 to 2.5 microns, a second component with >0.85 peak thermal emissivity in a window of 4 to 35 microns, and a third component to mechanically bind together the mixture of components.

Disclosed herein in is a radiative cooling formulation comprising a first component with >55% reflectance in wavelengths between 0.3 to 2.5 microns, a second component with >0.85 peak thermal emissivity in a window of 4 to 35 microns, and a third component to mechanically bind together the mixture of components.

Disclosed herein in is a radiative cooling formulation comprising a first component with >55% reflectance in wavelengths between 0.3 to 2.5 microns, a second component with >0.85 peak thermal emissivity in a window of 4 to 35 microns, and a third component to mechanically bind together the mixture of components.

Disclosed herein in is a radiative cooling formulation comprising a first component with >55% reflectance in a wavelengths range of 0.3 to 2.5 microns, a second component with >0.85 peak thermal emissivity in a window range of 4 to 35 microns, and a third component to mechanically bind together a mixture of the first and second components.

Disclosed herein in is a radiative cooling formulation comprising a first component with >55% reflectance in a wavelengths range of 0.3 to 2.5 microns, a second component with >0.85 peak thermal emissivity in a window range of 4 to 35 microns, and a third component to mechanically bind together a mixture of the first and second components.