Patent classifications
C09D133/04
Laminated film and method for producing same
The present invention provides a laminated film comprising a polyester film having a resin layer on at least one side thereof, wherein said resin layer contains at least metal oxide particles (A) having a number average particle diameter of 3 nm or more and 50 nm or less, and an acrylic resin (B), and a component (C.sub.1) derived from an oxazoline-based compound and/or a component (C.sub.2) derived from a melamine-based compound, and wherein said acrylic resin (B) contains a monomer unit (b.sub.1), a monomer unit (b.sub.2) and a monomer unit (b.sub.3). The present invention provides a laminated film which is excellent in transparency, suppression of interference pattern upon lamination of a high refractive index hard coat layer, adhesive property to a high refractive index hard coat layer, and adhesion under high temperature and high humidity conditions (adhesion under high temperature and high humidity conditions), at a low cost.
Laminated film and method for producing same
The present invention provides a laminated film comprising a polyester film having a resin layer on at least one side thereof, wherein said resin layer contains at least metal oxide particles (A) having a number average particle diameter of 3 nm or more and 50 nm or less, and an acrylic resin (B), and a component (C.sub.1) derived from an oxazoline-based compound and/or a component (C.sub.2) derived from a melamine-based compound, and wherein said acrylic resin (B) contains a monomer unit (b.sub.1), a monomer unit (b.sub.2) and a monomer unit (b.sub.3). The present invention provides a laminated film which is excellent in transparency, suppression of interference pattern upon lamination of a high refractive index hard coat layer, adhesive property to a high refractive index hard coat layer, and adhesion under high temperature and high humidity conditions (adhesion under high temperature and high humidity conditions), at a low cost.
COMPOSITION FOR POWDER COATING MATERIAL, POWDER COATING MATERIAL AND COATED ARTICLE
To provide a powder coating material capable of forming a coating film excellent in weather resistance, coating film appearance and surface smoothness; and a coated article having a coating film made of such a powder coating material. A powder coating material comprising a powder composed of a first composition which is a first composition for powder coating material comprising a fluororesin having a fluorine content of at least 10% by mass and a plasticizer having a melting point of from 60 to 200° C. and having a cyclic hydrocarbon group in the molecule, wherein the content of the plasticizer is from 0.1 to 40 parts by mass, to 100 parts by mass of the resin component contained in the first composition. And, a powder coating material comprising a powder composed of a second composition containing the fluororesin and a powder composed of a third composition containing a resin other than the fluororesin, wherein at least one of the second composition and the third composition contains a plasticizer, and the content of the plasticizer is from 0.1 to 40 parts by mass, to 100 parts by mass in total of the resin components contained in the second composition and the third composition.
Primer composition
A primer composition that resists peeling and cracking is provided that includes an acrylic copolymer having a Tg of between −15 and −35° C.
Metal packaging powder coating compositions, coated metal substrates, and methods
Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.
Metal packaging powder coating compositions, coated metal substrates, and methods
Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.
METALLIC COATING COMPOSITIONS
A pigment-containing coating formulation combines (i) polymeric wetting and dispersing additives that absorb onto pigment particles to surround pigment particles to prevent or limit sedimentation; (ii) a self-crosslinking acrylic dispersion with low surfactants and long open time, allowing the pigment to lay flat instead of migrating and agglomerating at the surface; and (3) rheology modification facilitating good Newtonian flow behavior and balanced thixotropic thickening of the coating for improved brushability, flow and leveling for improved appearance with keener light reflection and more uniform pearlescent and metallic effect appearance.
ULTRA LOW THERMO FUSION PVC ALTERNATIVE PLASTISOL COATING AND TEXTILE PRINTING INK
The present invention relates to a novel PVC-free plastisol composition that cures at a temperature much lower than conventional plastisols. Also disclosed is a method of applying the composition.
ULTRA LOW THERMO FUSION PVC ALTERNATIVE PLASTISOL COATING AND TEXTILE PRINTING INK
The present invention relates to a novel PVC-free plastisol composition that cures at a temperature much lower than conventional plastisols. Also disclosed is a method of applying the composition.
Dicing film and dicing die-bonding film
The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10.sup.5 to 4*10.sup.6 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.