The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10.sup.5 to 4*10.sup.6 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10.sup.5 to 4*10.sup.6 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

A polyhydroxyalkylamide material having the formula (I), wherein Z represents a polymer or an alkylene, alkenylene, alkynylene or arylene group; Z′ represents a bivalent organic linking group; m is 0 or 1; X represents a bivalent organic bridging group; R represents a hydroxyalkylamide group; and n is at least 2. The present invention extends to coatings compositions containing the polyhydroxyalkylamide material and articles coated with coatings derived from said coated compositions.

A polyhydroxyalkylamide material having the formula (I), wherein Z represents a polymer or an alkylene, alkenylene, alkynylene or arylene group; Z′ represents a bivalent organic linking group; m is 0 or 1; X represents a bivalent organic bridging group; R represents a hydroxyalkylamide group; and n is at least 2. The present invention extends to coatings compositions containing the polyhydroxyalkylamide material and articles coated with coatings derived from said coated compositions.

A polyhydroxyalkylamide material having the formula (I), wherein Z represents a polymer or an alkylene, alkenylene, alkynylene or arylene group; Z′ represents a bivalent organic linking group; m is 0 or 1; X represents a bivalent organic bridging group; R represents a hydroxyalkylamide group; and n is at least 2. The present invention extends to coatings compositions containing the polyhydroxyalkylamide material and articles coated with coatings derived from said coated compositions.

A composition for a multi-purpose floor finish is disclosed that includes at least one polymer, at least one plasticizer, and at least one hydrophobic glycol solvent. Further, the composition for a multi-purpose floor finish comprises a percent elongation of at least 100% and a tensile strength of at least 1000 psi.

Disclosed are ethylenically unsaturated salts of allyl (poly)ether sulfates utilized as reactive surfactants or emulsifiers during emulsion polymerization.

Disclosed are ethylenically unsaturated salts of allyl (poly)ether sulfates utilized as reactive surfactants or emulsifiers during emulsion polymerization.

A colored composition including a resin system, and a colorized filler. The colorized filler includes particles including a polymer. The particles have a density less than 2.6 g/cc and an average particle size from 100 microns to 600 microns.

A colored composition including a resin system, and a colorized filler. The colorized filler includes particles including a polymer. The particles have a density less than 2.6 g/cc and an average particle size from 100 microns to 600 microns.