C09D133/18

Random Copolymer, Laminate, and Method for Forming Pattern
20190064671 · 2019-02-28 ·

Provided are a random copolymer for forming a neutral layer promoting directed self-assembly pattern formation, a laminate for forming a pattern including the same, and a method for forming a high-quality pattern using the same.

COLLOIDAL (METH)ACRYLIC POLYMER EMULSION AND WATER-BASED HOT STAMPING PRIMER COATING
20180223124 · 2018-08-09 ·

The present invention is directed to a colloidal (meth)acrylic polymer emulsion, wherein the (meth)acrylic polymer has a weight average molecular weight of 3000 to 8000 daltons, Tg of 110 to 140 C. and an acid value of 150 to 240 mgKOH/g. The present invention also provide a water-based hot stamping primer coating which comprises the colloidal (meth)acrylic polymer emulsion. The present invention further provides a hot stamping film comprising a hot stamping primer formed from the water-based hot stamping primer coating.

Fluorine-containing urethane (meth)acrylate, curable composition, and antireflective film
10000657 · 2018-06-19 · ·

It is an object of the present invention to provide a urethane (meth)acrylate that enables formation of a cured layer having a low reflectance and excellent excoriation resistance, a curable composition produced by using the same, and an antireflective film. In particular, there is provided a fluorine-containing urethane (meth)acrylate represented by General Formula (I) and having a fluorine atom content ranging from 25 to 60 mass % (where R.sub.1 and R.sub.2 each represent a specific fluorinated alkyl group, R.sub.3 and R.sub.4 each represent a hydrogen atom or a methyl group, A represents a trivalent linking group represented by any of Structural Formulae (A1) to (A4), and X and Y each independently represent a divalent linking group represented by any of Structural Formulae (a) to (c)) [in Structural Formula (c), R5 represents an alkyl group having 1 to 6 carbon atoms].

Fluorine-containing urethane (meth)acrylate, curable composition, and antireflective film
10000657 · 2018-06-19 · ·

It is an object of the present invention to provide a urethane (meth)acrylate that enables formation of a cured layer having a low reflectance and excellent excoriation resistance, a curable composition produced by using the same, and an antireflective film. In particular, there is provided a fluorine-containing urethane (meth)acrylate represented by General Formula (I) and having a fluorine atom content ranging from 25 to 60 mass % (where R.sub.1 and R.sub.2 each represent a specific fluorinated alkyl group, R.sub.3 and R.sub.4 each represent a hydrogen atom or a methyl group, A represents a trivalent linking group represented by any of Structural Formulae (A1) to (A4), and X and Y each independently represent a divalent linking group represented by any of Structural Formulae (a) to (c)) [in Structural Formula (c), R5 represents an alkyl group having 1 to 6 carbon atoms].

BINDER RESIN COMPOSITION, ELECTRODE FOR LITHIUM ION SECONDARY BATTERY AND LITHIUM ION SECONDARY BATTERY

The present disclosure provides a binder resin composition comprising a polyolefin particle, an organic solvent and a polymer that is soluble in the organic solvent, as well as an electrode for a lithium ion secondary battery and a lithium ion secondary battery each using the binder resin composition.

Resin blend

Provided is a resin blend including a first resin and a second resin, the second resin having a hydrophobic functional group in a side chain and having a surface energy difference of 0.1 to 20 mN/m from the first resin at 25 C., wherein the resin blend is capable of forming a layer separation structure. Also, provided are a pellet, a method for preparing the same, and a resin molding article having a specific layer separation structure. The resin blend may not only improve mechanical properties and surface hardness of the molding article but also shorten process time, increase productivity and reduce production cost by omitting an additional surface coating step.

Resin blend

Provided is a resin blend including a first resin and a second resin, the second resin having a hydrophobic functional group in a side chain and having a surface energy difference of 0.1 to 20 mN/m from the first resin at 25 C., wherein the resin blend is capable of forming a layer separation structure. Also, provided are a pellet, a method for preparing the same, and a resin molding article having a specific layer separation structure. The resin blend may not only improve mechanical properties and surface hardness of the molding article but also shorten process time, increase productivity and reduce production cost by omitting an additional surface coating step.

Resin blend

Provided is a resin blend including a first resin and a second resin, the second resin having a hydrophobic functional group in a side chain and having a surface energy difference of 0.1 to 20 mN/m from the first resin at 25 C., wherein the resin blend is capable of forming a layer separation structure. Also, provided are a pellet, a method for preparing the same, and a resin molding article having a specific layer separation structure. The resin blend may not only improve mechanical properties and surface hardness of the molding article but also shorten process time, increase productivity and reduce production cost by omitting an additional surface coating step.

COATING AGENT AND ELECTRONIC COMPONENT MODULE MANUFACTURING METHOD
20260101430 · 2026-04-09 · ·

Provided is a coating agent capable of forming a coating film having high heat insulating properties. The coating agent according to the present invention is a coating agent used for forming a coating film in an electronic component module in which an electronic component is mounted on a circuit board via a conductive adhesive portion, the conductive adhesive portion being coated with a coating film, the coating agent includes a thermoplastic resin, a solvent that dissolves the thermoplastic resin, and hollow particles, in which a content of the thermoplastic resin is 1.0 wt % or more and 22.0 wt % or less based on 100 wt % of a total content of the thermoplastic resin and the solvent, and a content of the hollow particles is 15.0 parts by weight or more and 50.0 parts by weight or less based on 100 parts by weight of the total content of the thermoplastic resin and the solvent.

COATING AGENT AND ELECTRONIC COMPONENT MODULE MANUFACTURING METHOD
20260101430 · 2026-04-09 · ·

Provided is a coating agent capable of forming a coating film having high heat insulating properties. The coating agent according to the present invention is a coating agent used for forming a coating film in an electronic component module in which an electronic component is mounted on a circuit board via a conductive adhesive portion, the conductive adhesive portion being coated with a coating film, the coating agent includes a thermoplastic resin, a solvent that dissolves the thermoplastic resin, and hollow particles, in which a content of the thermoplastic resin is 1.0 wt % or more and 22.0 wt % or less based on 100 wt % of a total content of the thermoplastic resin and the solvent, and a content of the hollow particles is 15.0 parts by weight or more and 50.0 parts by weight or less based on 100 parts by weight of the total content of the thermoplastic resin and the solvent.