Patent classifications
C09D135/04
PHTHALONITRILE-BASED HIGH TEMPERATURE RESISTIVE INKS
Resistive inks and method of making resistive inks that utilize a phthalonitrile resin as a curable component in the inks are disclosed. In one example, a resistive ink is provided. The resistive ink comprises a solvent, a thermally-curable phthalonitrile-based resin dissolved in the solvent, and one or more conductive fillers. In some examples, the phthalonitrile resin can comprise a B-staged material.
Light-curable compositions useful for forming composite materials
Composite materials are formed by photo curing compositions containing one or more cyanoacrylates, substantial amounts of one or more fillers (in particular, opaque and/or fibrous fillers such as carbon fibers) as well as particular photoinitiator systems. The photoinitiator system may comprise, for example, a metallocene compound such as a ferrocene in combination with an acylgermane or other photocleavable compound which generates an acyl radical when exposed to light. Complete, deep curing of such compositions to provide composite materials having improved mechanical properties can be achieved, even though the light used to initiate curing may not be capable of penetrating the entire thickness of the composition due to the presence of the filler.
Light-curable compositions useful for forming composite materials
Composite materials are formed by photo curing compositions containing one or more cyanoacrylates, substantial amounts of one or more fillers (in particular, opaque and/or fibrous fillers such as carbon fibers) as well as particular photoinitiator systems. The photoinitiator system may comprise, for example, a metallocene compound such as a ferrocene in combination with an acylgermane or other photocleavable compound which generates an acyl radical when exposed to light. Complete, deep curing of such compositions to provide composite materials having improved mechanical properties can be achieved, even though the light used to initiate curing may not be capable of penetrating the entire thickness of the composition due to the presence of the filler.
Dip-coat binder solutions comprising metal dip-coat powder for use in additive manufacturing
A dip-coat binder solution comprises a metal dip-coat powder and a dip-coat binder. The dip-coat binder solution has a viscosity greater than or equal to 1 cP and less than or equal to 40 cP. The metal dip-coat powder may comprise a stainless steel alloy, a nickel alloy, a copper alloy, a copper-nickel alloy, a cobalt-chrome alloy, a titanium alloy, an aluminum alloy, a tungsten alloy, or a combination thereof. A method of forming a part includes providing a green body part comprising a plurality of layers of print powder, dipping the green body part in a dip-coat binder solution to form a dip-coated green body part, and heating the dip-coated green body part. After dipping, the dip-coated green body part has a surface roughness Ra less than or equal to 10 m.
Dip-coat binder solutions comprising metal dip-coat powder for use in additive manufacturing
A dip-coat binder solution comprises a metal dip-coat powder and a dip-coat binder. The dip-coat binder solution has a viscosity greater than or equal to 1 cP and less than or equal to 40 cP. The metal dip-coat powder may comprise a stainless steel alloy, a nickel alloy, a copper alloy, a copper-nickel alloy, a cobalt-chrome alloy, a titanium alloy, an aluminum alloy, a tungsten alloy, or a combination thereof. A method of forming a part includes providing a green body part comprising a plurality of layers of print powder, dipping the green body part in a dip-coat binder solution to form a dip-coated green body part, and heating the dip-coated green body part. After dipping, the dip-coated green body part has a surface roughness Ra less than or equal to 10 m.
DIP-COAT BINDER SOLUTIONS COMPRISING METAL DIP-COAT POWDER FOR USE IN ADDITIVE MANUFACTURING
A dip-coat binder solution comprises a metal dip-coat powder and a dip-coat binder. The dip-coat binder solution has a viscosity greater than or equal to 1 cP and less than or equal to 40 cP. The metal dip-coat powder may comprise a stainless steel alloy, a nickel alloy, a copper alloy, a copper-nickel alloy, a cobalt-chrome alloy, a titanium alloy, an aluminum alloy, a tungsten alloy, or a combination thereof. A method of forming a part includes providing a green body part comprising a plurality of layers of print powder, dipping the green body part in a dip-coat binder solution to form a dip-coated green body part, and heating the dip-coated green body part. After dipping, the dip-coated green body part has a surface roughness Ra less than or equal to 10 m.
DIP-COAT BINDER SOLUTIONS COMPRISING METAL DIP-COAT POWDER FOR USE IN ADDITIVE MANUFACTURING
A dip-coat binder solution comprises a metal dip-coat powder and a dip-coat binder. The dip-coat binder solution has a viscosity greater than or equal to 1 cP and less than or equal to 40 cP. The metal dip-coat powder may comprise a stainless steel alloy, a nickel alloy, a copper alloy, a copper-nickel alloy, a cobalt-chrome alloy, a titanium alloy, an aluminum alloy, a tungsten alloy, or a combination thereof. A method of forming a part includes providing a green body part comprising a plurality of layers of print powder, dipping the green body part in a dip-coat binder solution to form a dip-coated green body part, and heating the dip-coated green body part. After dipping, the dip-coated green body part has a surface roughness Ra less than or equal to 10 m.
COLLOIDAL DISPERSIONS AND PROCESSES OF MAKING AND USING SAME
The present invention relates to colloidal dispersions and processes of making and using same. Such dispersions comprise an organic monomer and van der Waals materials having little or no oxidation and conformational distortion. As a result, such dispersions can provide two dimensional and three dimensional structures that are made from, in whole or in part, from such colloidal dispersions with unique optical, magnetic and electrical properties. Processes of making and using such dispersions are also disclosed.
COLLOIDAL DISPERSIONS AND PROCESSES OF MAKING AND USING SAME
The present invention relates to colloidal dispersions and processes of making and using same. Such dispersions comprise an organic monomer and van der Waals materials having little or no oxidation and conformational distortion. As a result, such dispersions can provide two dimensional and three dimensional structures that are made from, in whole or in part, from such colloidal dispersions with unique optical, magnetic and electrical properties. Processes of making and using such dispersions are also disclosed.
COPOLYMER AND RESIN COMPOSITION CONTAINING COPOLYMER
Provided is a copolymer capable of suppressing coloration even after heating. A copolymer containing a constitutional unit (A) derived from 11-dicyanoethylene and a constitutional unit (B) derived from a compound represented by the following general formula (I):
##STR00001## in which the copolymer includes the following four kinds of triad structures (U-1) to (U-4) composed of the constitutional unit (A) and the constitutional unit (B),
##STR00002## and a total content of (U-2) and (U-3) in a total amount of the four kinds of triad structures is 9.0 mol % or less.