The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent, where X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 1 to 10, and R.sub.1 represents at least one or more of the following general formulae (2) to (4). This aims to provide an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate. ##STR00001##

It is provided a coating composition comprising an ionic liquid, and a crosslinked polymeric ionic liquid, wherein the crosslinked polymeric ionic liquid and the ionic liquid are not linked through covalent bonds, and wherein the crosslinked polymeric ionic liquid is linked to a substrate surface. It is also provided a process for its preparation, as well as an article of manufacture at least in part coated with the coating composition as defined above.

It is provided a coating composition comprising an ionic liquid, and a crosslinked polymeric ionic liquid, wherein the crosslinked polymeric ionic liquid and the ionic liquid are not linked through covalent bonds, and wherein the crosslinked polymeric ionic liquid is linked to a substrate surface. It is also provided a process for its preparation, as well as an article of manufacture at least in part coated with the coating composition as defined above.

A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.

A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.

A surface treatment liquid which adhesiveness of a component that achieves a surface treatment effect is good, and a desired surface treatment effect is easily obtained, and a surface treatment method using the surface treatment liquid are provided.

A surface treatment liquid including a resin (A) and a solvent (S), in which the resin (A) includes a constituent unit (a1) derived form a compound having a hydrophilic group and an ethylenic double bond and a constituent unit (a2) derived from a compound a nitrogen-containing heterocyclic group, an ethylenic double bond, and a specific type of polar group is used.

A surface treatment liquid which adhesiveness of a component that achieves a surface treatment effect is good, and a desired surface treatment effect is easily obtained, and a surface treatment method using the surface treatment liquid are provided.

A surface treatment liquid including a resin (A) and a solvent (S), in which the resin (A) includes a constituent unit (a1) derived form a compound having a hydrophilic group and an ethylenic double bond and a constituent unit (a2) derived from a compound a nitrogen-containing heterocyclic group, an ethylenic double bond, and a specific type of polar group is used.

A novel copolymer suitable for an optical film which is excellent in optical characteristics and has high retardation even in a thin film state, and an optical film containing the same are provided. A copolymer excellent in optical characteristics and easy to form a composite with a different polymer, and an optical film composed of the same are also provided.

A novel copolymer suitable for an optical film which is excellent in optical characteristics and has high retardation even in a thin film state, and an optical film containing the same are provided. A copolymer excellent in optical characteristics and easy to form a composite with a different polymer, and an optical film composed of the same are also provided.

A polymerizable composition is described comprising at least one monomer, oligomer, polymer, or a combination thereof comprising ethylenically unsaturated groups; and at least one cyclic imide monomer comprising an α, β-unsaturated carbonyl. The cyclic imide monomer comprises an imide group and the α, β-unsaturated carbonyl in a heterocyclic ring wherein the ring comprises at least 6 covalently bonded atoms. Also described are cyclic imide monomers, (e.g. hardcoat) compositions, methods of making a coated substrate, cyclic imide monomers, and methods of making cyclic imide monomers.