A self-healing capacitor comprises a first electrode, a second electrode, and a dielectric layer disposed between said first and second electrodes and having first surface faced the first electrode and second surface faced the second electrode. At least one of the electrodes can include metal foam. The dielectric layer can have electrically conductive channels that each has an exit point located on the first surface of the dielectric layer and another exit point located on the second surface of the dielectric layer. The electrodes can include local contact breakers each of which is located within the electrode at an interface between the dielectric layer and the electrode and opposite at least one exit point of each electrically conductive channel in the dielectric layer. The local contact breakers can prevent electric current through the conductive channels in dielectric layer.

A resin composition includes an acrylic resin and a graft copolymer having a gel content of 65% to 84%, wherein the graft copolymer is a multistage-polymerized graft copolymer obtained by a multistage polymerization including the polymerization stages (I) to (III). In the polymerization stage (I), a first monomer mixture and a polyfunctional monomer are polymerized in a presence of a primary alkyl mercaptan-based chain transfer agent and/or a secondary alkyl mercaptan-based chain transfer agent to obtain a first hard polymer. In the polymerization stage (II), a second monomer mixture and a polyfunctional monomer are poloymerized to obtain a soft polymer. In the polymerization stage (III), a third monomer mixture and a polyfunctional monomer are polymerized to obtain a second hard polymer.

A resin composition includes an acrylic resin and a graft copolymer having a gel content of 65% to 84%, wherein the graft copolymer is a multistage-polymerized graft copolymer obtained by a multistage polymerization including the polymerization stages (I) to (III). In the polymerization stage (I), a first monomer mixture and a polyfunctional monomer are polymerized in a presence of a primary alkyl mercaptan-based chain transfer agent and/or a secondary alkyl mercaptan-based chain transfer agent to obtain a first hard polymer. In the polymerization stage (II), a second monomer mixture and a polyfunctional monomer are poloymerized to obtain a soft polymer. In the polymerization stage (III), a third monomer mixture and a polyfunctional monomer are polymerized to obtain a second hard polymer.

The transfer film includes a temporary support and a photosensitive transparent resin layer formed on the temporary support, in which the photosensitive transparent resin layer includes a binder polymer, a photopolymerizable compound having an ethylenic unsaturated group, a photopolymerization initiator, and a blocked isocyanate, the binder polymer is a carboxyl group-containing acrylic resin having an acid value of 60 mgKOH/g or more, and the transfer film is to protect electrodes in electrostatic capacitance-type input devices.

Binder systems for high gloss coatings and processes for producing them

The problem to be solved by the present invention is to provide an aqueous coating composition that can form a multilayer coating film having excellent storage stability, excellent adhesion to plastic base materials, excellent finish, and excellent coating film performance, such as water resistance; and to also provide a coating method using the composition. The present invention provides an aqueous coating composition comprising (A) an aqueous dispersion of a modified polyolefin, (B) an aqueous acrylic resin and/or an aqueous polyester resin, and (C) a phosphoric acid compound represented by a specific formula; and also provides a method for forming a coating film, comprising applying the aqueous coating composition, as well as an article coated with the aqueous coating composition.

The problem to be solved by the present invention is to provide an aqueous coating composition that can form a multilayer coating film having excellent storage stability, excellent adhesion to plastic base materials, excellent finish, and excellent coating film performance, such as water resistance; and to also provide a coating method using the composition. The present invention provides an aqueous coating composition comprising (A) an aqueous dispersion of a modified polyolefin, (B) an aqueous acrylic resin and/or an aqueous polyester resin, and (C) a phosphoric acid compound represented by a specific formula; and also provides a method for forming a coating film, comprising applying the aqueous coating composition, as well as an article coated with the aqueous coating composition.

Described herein are graft copolymer pretreatment compositions that impart improved corrosion resistance, enhanced adhesion performance, lubrication, improved coating performance (e.g., enhanced wettability), and/or improved weldability and/or weld durability to metals (e.g., aluminum alloys) as compared to non-pretreated metal surfaces. Also provided herein are aluminum alloys coated with the disclosed graft copolymer pretreatment compositions and methods for applying the disclosed graft copolymer pretreatment compositions to aluminum alloys.

Water-dispersible or water-dispersed polymers are made by reacting (i) an unsaturated monomer containing one or more cyclic carbonate groups, or (ii) an unsaturated or saturated oligomer or polymer containing a plurality of cyclic carbonate groups, with a tertiary amine in the presence of an acid, or with an acid in the presence of a tertiary amine, or in the presence of an acid and a tertiary amine, to provide a water-dispersible or water-dispersed monomer, oligomer or polymer. When step a) provides a monomer or oligomer, the monomer or oligomer is reacted with one or more monomers in the presence of an initiator to provide a water-dispersible or water-dispersed polymer. When step a) provides a polymer, the polymer is optionally used to support emulsion polymerization of one or more unsaturated monomers in the presence of an initiator to provide a water-dispersible or water-dispersed further polymer.

An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160° C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa.Math.s or less at the reaction start temperature, 400 Pa.Math.s or less at any temperature which is equal to or higher than a temperature lower by 40° C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa.Math.s or less at a temperature lower by 50° C. than the reaction start temperature.