Patent classifications
C09D151/04
Primer composition and adhesive tape
An object of the invention is to provide a primer composition for application between the base film and the adhesive layer of an adhesive tape that can improve the adhesion between the base film and the adhesive layer of the adhesive tape and an adhesive tape prepared by using the primer composition. A primer composition, comprising 100 parts by mass (as solid matter) of a graft polymer of a natural rubber graft-polymerized with 15 to 65 mass % of methyl methacrylate and 25 to 300 parts by mass of a carboxyl group-modified acrylonitrile butadiene rubber.
METHODS OF CURING COMPOSITIONS BASED ON MULTISTAGE POLYMERS
Compositions which are curable by, for example, exposure to radiation to form useful articles such as three-dimensionally printed objects are prepared using multistage polymers, polymerizing organic substances and (meth)acrylic polymers. The multistage polymer is effective to toughen and impact modify the cured articles, yet the compositions prior to curing are relatively low in viscosity and agglomerate content even at high loadings of multistage polymer.
METHODS OF CURING COMPOSITIONS BASED ON MULTISTAGE POLYMERS
Compositions which are curable by, for example, exposure to radiation to form useful articles such as three-dimensionally printed objects are prepared using multistage polymers, polymerizing organic substances and (meth)acrylic polymers. The multistage polymer is effective to toughen and impact modify the cured articles, yet the compositions prior to curing are relatively low in viscosity and agglomerate content even at high loadings of multistage polymer.
Multigraft copolymers as superelastomers
Thermoplastic elastomer compositions are described comprising multigraft copolymers. The multigraft copolymers can comprise a rubbery polymeric backbone and a plurality of glassy polymeric side chains, each attached at one of a plurality of branch points randomly spaced along the backbone. The copolymer materials have high tensile strength, high strain at break, and low residual strain after elongation. The compositions can be used as adhesives and in a wide variety of high tech, medical, and commodity applications.
Multigraft copolymers as superelastomers
Thermoplastic elastomer compositions are described comprising multigraft copolymers. The multigraft copolymers can comprise a rubbery polymeric backbone and a plurality of glassy polymeric side chains, each attached at one of a plurality of branch points randomly spaced along the backbone. The copolymer materials have high tensile strength, high strain at break, and low residual strain after elongation. The compositions can be used as adhesives and in a wide variety of high tech, medical, and commodity applications.
DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM
A thermosetting resin composition having low dielectric constant, low dielectric loss tangent, high glass transition point, and excellent water resistance, and cured product therefrom. The thermosetting resin composition includes the following components (A) and (B). (A) a compound of formula (I) (X.sup.1 and X.sup.2 each independently represent a C1-C20 alkyl group or the like, n1 and n2 each independently represent 0 or 1, Z.sup.1 and Z.sup.2 each independently represent a single bond or the like, X.sup.3 and X.sup.4 each independently represent an organic group or the like, m1 and m2 each independently represent any integer from 0 to 4, and Y represents a polymerizable functional group) (B) a maleimide compound having one or more maleimide groups, a polyphenylene ether compound, polybutadiene, a styrene-butadiene-styrene block copolymer, or polymer having repeat unit of formula (III) (Z.sup.3 represents C6-C12 arylene group, and R.sup.2 to R.sup.7 each independently represent hydrogen atom or the like).
DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREFROM
A thermosetting resin composition having low dielectric constant, low dielectric loss tangent, high glass transition point, and excellent water resistance, and cured product therefrom. The thermosetting resin composition includes the following components (A) and (B). (A) a compound of formula (I) (X.sup.1 and X.sup.2 each independently represent a C1-C20 alkyl group or the like, n1 and n2 each independently represent 0 or 1, Z.sup.1 and Z.sup.2 each independently represent a single bond or the like, X.sup.3 and X.sup.4 each independently represent an organic group or the like, m1 and m2 each independently represent any integer from 0 to 4, and Y represents a polymerizable functional group) (B) a maleimide compound having one or more maleimide groups, a polyphenylene ether compound, polybutadiene, a styrene-butadiene-styrene block copolymer, or polymer having repeat unit of formula (III) (Z.sup.3 represents C6-C12 arylene group, and R.sup.2 to R.sup.7 each independently represent hydrogen atom or the like).
Dielectric film-forming composition
This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
Dielectric film-forming composition
This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.