A light-shielding composition includes a light-shielding pigment, a resin, a polymerizable compound, which is a low-molecular-weight compound containing an ethylenically unsaturated group, and a polymerization initiator, in which the light-shielding pigment contains an inorganic particle, and an inorganic compound coating the inorganic particle, the inorganic particle contains one or more nitrogen-containing metal compounds selected from the group consisting of zirconium nitride, zirconium oxynitride, vanadium nitride, vanadium oxynitride, niobium nitride, and niobium oxynitride, the inorganic compound contains a silicon atom, and a contained atom number ratio of a total content of metallic atoms, which are selected from the group consisting of a zirconium atom, a vanadium atom, and a niobium atom, to a content of the silicon atom in a surface of the light-shielding pigment, as determined by X-ray photoelectron spectroscopy, is greater than 1.0.

A light-shielding composition includes a light-shielding pigment, a resin, a polymerizable compound, which is a low-molecular-weight compound containing an ethylenically unsaturated group, and a polymerization initiator, in which the light-shielding pigment contains an inorganic particle, and an inorganic compound coating the inorganic particle, the inorganic particle contains one or more nitrogen-containing metal compounds selected from the group consisting of zirconium nitride, zirconium oxynitride, vanadium nitride, vanadium oxynitride, niobium nitride, and niobium oxynitride, the inorganic compound contains a silicon atom, and a contained atom number ratio of a total content of metallic atoms, which are selected from the group consisting of a zirconium atom, a vanadium atom, and a niobium atom, to a content of the silicon atom in a surface of the light-shielding pigment, as determined by X-ray photoelectron spectroscopy, is greater than 1.0.

A porous resin film for a metal layer laminate board and a metal layer laminate board are provided to suppress damage to a metal layer disposed on an inner peripheral surface of a through hole and to have excellent electrical connection reliability even under the high temperature environment. The porous resin film for a metal layer laminate board is used in lamination of a metal layer. The porous resin film for a metal layer laminate board has a minimum thermal expansion coefficient X in a plane direction perpendicular to a thickness direction and a thermal expansion coefficient Z in the thickness direction. In the porous resin film for a metal layer laminate board, a ratio (Z/X) of the thermal expansion coefficient Z in the thickness direction to the minimum thermal expansion coefficient X is 3.5 or less.

A porous resin film for a metal layer laminate board and a metal layer laminate board are provided to suppress damage to a metal layer disposed on an inner peripheral surface of a through hole and to have excellent electrical connection reliability even under the high temperature environment. The porous resin film for a metal layer laminate board is used in lamination of a metal layer. The porous resin film for a metal layer laminate board has a minimum thermal expansion coefficient X in a plane direction perpendicular to a thickness direction and a thermal expansion coefficient Z in the thickness direction. In the porous resin film for a metal layer laminate board, a ratio (Z/X) of the thermal expansion coefficient Z in the thickness direction to the minimum thermal expansion coefficient X is 3.5 or less.

Durable, anti-fouling, crosslinked zwitterionic coatings that are grafted to the surface of a substrate through covalent bonding are disclosed. When exposed to a light source, zwitterionic monomers react with a crosslinker and with activated radicals at the surface of the substrate, simultaneously forming the crosslinked zwitterionic coating and anchoring it to the surface of the substrate. Photomasking techniques can be used to micropattern the zwitterionic coatings. The zwitterionic coatings can be applied to a variety of substrates, including medical devices and systems.

The present invention makes it possible to maintain a high 180-degree peel strength of a photocurable composition having a film shape at 25° C. in the state of not being cured against untreated PET as an adherend when bonding is performed by lamination at normal temperature. A photocurable composition having a film shape at 25° C. in a state of not being cured, which contains the following components (A) to (C) and in which the photocurable composition contains 1 to 45 parts by mass of the component (B) with respect to 100 parts by mass of the component (A), a temperature of tan δ=1 is 30° C. to 60° C. before curing, a storage elastic modulus at 25° C. is 10.0×10.sup.5 Pa or less after curing. Component (A): urethane-modified (meth)acrylate oligomer Component (B): film forming agent Component (C): photoinitiator

An anionically-stabilized aqueous emulsion composition includes a) a first emulsion polymer having a Tg from −60° C. to 40° C.; b) a volatile base; and c) polymeric particles, different from the first emulsion polymer and present in emulsified form. The c) polymeric particles are polyamine graft copolymers, in which vinyl monomers form a polymer grafted to a water-soluble amino-group containing polymer. The anionically-stabilized aqueous emulsion composition may have a pH of from 8 to 11.

An anionically-stabilized aqueous emulsion composition includes a) a first emulsion polymer having a Tg from −60° C. to 40° C.; b) a volatile base; and c) polymeric particles, different from the first emulsion polymer and present in emulsified form. The c) polymeric particles are polyamine graft copolymers, in which vinyl monomers form a polymer grafted to a water-soluble amino-group containing polymer. The anionically-stabilized aqueous emulsion composition may have a pH of from 8 to 11.

A composition contains at least one siloxane having ethylenically unsaturated, radically-polymerizable groups, and at least one hydrocarbon having 2 to 6 ethylenically-unsaturated, radically-polymerizable groups, and can be used as a release coating, said composition allowing a good degree of release behavior from adhesive compounds while at the same time also achieving a high level of adhesion of the coating to the carrier material.

A radiation curable secondary coating composition for optical fiber is described and claimed. This radiation curable secondary coating composition includes component (A) which is a urethane (meth)acrylate and component (B) which is a (meth)acrylate compound with two or more ethylenically unsaturated groups and one or more bisphenol structures; wherein the content of component (B) in the composition is 60-300 mass parts per 100 mass parts of component (A). The liquid secondary coating has a viscosity at 25° C. of from about 0.1 Pa.Math.s to about 15 Pa.Math.s. Films obtained by curing the liquid radiation curable secondary coating composition of the present invention have a Young's modulus of from about 600 MPa to about 500 MPa and the breaking elongation of the cured film is from about to 5% to about 50%.