Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25° C. and free of solvent: (A) silicone-modified polyimide resin; (B) polymerizable compound; (C) polymerization initiator, (D) hydrophobic fumed silica; and (E) adhesion auxiliary agent.

Disclosed are graft copolymers, compositions including graft copolymers, intermediate materials, and related methods, where the graft copolymer includes a first polymer component including a 1,1-disubstituted-1-alkene compound (preferably a methylene malonate compound) and is grafted to a second component. The resulting graft copolymer may be hydrophilic or water soluble. The second component preferably is a hydrophilic component.

Latex binders useful for preparing zero or low VOC coating compositions having excellent freeze-thaw stability, good tint strength and good scrub resistance when cured may be obtained using a polymerizable polyalkylene glycol monomer such as polyethylene glycol methacrylate in combination with one or both of an emulsifier or a polymerizable polyalkylene glycol monomer containing bulky hydrophobic groups substituted on an aromatic ring.

Latex binders useful for preparing zero or low VOC coating compositions having excellent freeze-thaw stability, good tint strength and good scrub resistance when cured may be obtained using a polymerizable polyalkylene glycol monomer such as polyethylene glycol methacrylate in combination with one or both of an emulsifier or a polymerizable polyalkylene glycol monomer containing bulky hydrophobic groups substituted on an aromatic ring.

An active energy ray curing composition contains a urethane acrylate oligomer (A) having three or more polymerizable functional groups, a polyfunctional monomer (B) having three or more polymerizable functional groups, a monofunctional monomer (C), and a surfactant (D) having a siloxane bond, wherein the urethane acrylate oligomer (A) has a glass transition temperature of 85 degrees C. or lower, wherein the urethane acrylate oligomer (A) has a weight average molecular weight of from 1,000 to 9,000, wherein the polyfunctional monomer (B) accounts for 22.0 to 60.0 percent by mass of the entire of the active energy ray curing composition.

An active energy ray curing composition contains a urethane acrylate oligomer (A) having three or more polymerizable functional groups, a polyfunctional monomer (B) having three or more polymerizable functional groups, a monofunctional monomer (C), and a surfactant (D) having a siloxane bond, wherein the urethane acrylate oligomer (A) has a glass transition temperature of 85 degrees C. or lower, wherein the urethane acrylate oligomer (A) has a weight average molecular weight of from 1,000 to 9,000, wherein the polyfunctional monomer (B) accounts for 22.0 to 60.0 percent by mass of the entire of the active energy ray curing composition.

An encapsulation resin composition is used to hermetically seal a gap between a base member and a semiconductor chip bonded onto the base member. The encapsulation resin composition has a reaction start temperature of 160° C. or less. A melt viscosity of the encapsulation resin composition is 200 Pa.Math.s or less at the reaction start temperature, 400 Pa.Math.s or less at any temperature which is equal to or higher than a temperature lower by 40° C. than the reaction start temperature and which is equal to or lower than the reaction start temperature, and 1,000 Pa.Math.s or less at a temperature lower by 50° C. than the reaction start temperature.

The present disclosure relates to an acrylic modified polyester resin, and specifically, a modified polyester resin prepared by grafting an acrylic monomer to a polyester prepolymer. The polyester prepolymer is formed from pentaerythritol, a polyol monomer, an organic polycarboxylic acid monomer and a cycloalkanedicarboxylic acid monomer and contains a double bond on its backbone. The present disclosure also relates to a method for preparing the acrylic modified polyester resin.

The present specification relates to an optical film including a transparent film, and a coating layer on at least one surface of the transparent film, wherein the coating layer includes a polyester-based resin and a polyurethane-based resin, and is formed using a composition having a minimum film-forming temperature difference of 40° C. to 110° C. between the polyester-based resin and the polyurethane-based resin, and a polarizing plate including the same.

The present specification relates to an optical film including a transparent film, and a coating layer on at least one surface of the transparent film, wherein the coating layer includes a polyester-based resin and a polyurethane-based resin, and is formed using a composition having a minimum film-forming temperature difference of 40° C. to 110° C. between the polyester-based resin and the polyurethane-based resin, and a polarizing plate including the same.