The present invention relates to a polymer latex for dip-molding applications obtainable by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of 50 C. to 50 C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, to a method of preparing said polymer latex, to articles made by using said polymer latex and to a method for preparing dip-molded articles from said polymer latex.

The present invention relates to a polymer latex for dip-molding applications obtainable by free-radical emulsion polymerization of a mixture of ethylenically unsaturated monomers comprising at least one conjugated diene and at least one ethylenically unsaturated nitrile compound in an aqueous medium in presence of seed latex particles having a glass transition temperature (mid point temperature Tmg) measured by DSC according to ASTM D3418-03 of 50 C. to 50 C. wherein the seed latex particles do not contain structural units derived from ethylenically unsaturated nitrile compounds, to a method of preparing said polymer latex, to articles made by using said polymer latex and to a method for preparing dip-molded articles from said polymer latex.

The invention relates to a hot-melt pressure sensitive adhesive composition comprising at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil and from 4 to 15% by weight of at least one wax selected from the group consisting of paraffin waxes, Fischer-Tropsch waxes, ethylene-vinyl acetate waxes and any mixture thereof, based on the total weight of the hot-melt pressure sensitive adhesive composition. The invention also relates to an article comprising a surface coated with such a hot-melt pressure sensitive adhesive composition, to a use of such a hot-melt pressure sensitive adhesive composition and to a process for preparing such a hot-melt pressure sensitive adhesive composition.

The invention relates to a hot-melt pressure sensitive adhesive composition comprising at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil and from 4 to 15% by weight of at least one wax selected from the group consisting of paraffin waxes, Fischer-Tropsch waxes, ethylene-vinyl acetate waxes and any mixture thereof, based on the total weight of the hot-melt pressure sensitive adhesive composition. The invention also relates to an article comprising a surface coated with such a hot-melt pressure sensitive adhesive composition, to a use of such a hot-melt pressure sensitive adhesive composition and to a process for preparing such a hot-melt pressure sensitive adhesive composition.

The embodiment relates to a resin film including: an insulation-member-forming resin layer containing a first resin composition; and a primer-layer-forming resin layer provided on one side of the insulation-member-forming resin layer and containing a second resin composition, the first resin composition containing a thermosetting resin (A), a compound that is in a liquid state at 25 C., has a reactive group, and has a molecular weight of 1,000 or less (B), and an inorganic filler (C), as well as a printed wiring board and a semiconductor package, in each of which the resin film is used.

The embodiment relates to a resin film including: an insulation-member-forming resin layer containing a first resin composition; and a primer-layer-forming resin layer provided on one side of the insulation-member-forming resin layer and containing a second resin composition, the first resin composition containing a thermosetting resin (A), a compound that is in a liquid state at 25 C., has a reactive group, and has a molecular weight of 1,000 or less (B), and an inorganic filler (C), as well as a printed wiring board and a semiconductor package, in each of which the resin film is used.

A polymer composition including particles having a ratio of an average particle diameter D90 to an average particle diameter D50 of 2.3 or less, and a polymer having a dielectric loss tangent of 0.01 or less, and applications thereof.

A polymer composition including particles having a ratio of an average particle diameter D90 to an average particle diameter D50 of 2.3 or less, and a polymer having a dielectric loss tangent of 0.01 or less, and applications thereof.

Provided is a polymer film including a material A which is a liquid at 260 C., and a material B which is a solid at 260 C., in which the material A and the material B are phase-separated, in a cross section of the polymer film along a thickness direction, a ratio of a total length of phase-separated interfaces between the material A and the material B to a length of the polymer film in a direction perpendicular to the thickness direction at a thickness of 50 um is 2 or more, and the polymer film has an elastic modulus at 160 C. of 0.60 MPa or less, and a dielectric loss tangent of 0.01 or less.

The thermal interface material (TIM) system of the present disclosure includes a thermal pad having a thermoplastic elastomeric copolymer coupled to a thermally conductive nanoparticle. The thermoplastic elastomeric copolymer may include glassy and rubbery polymers. In a specific example, the thermoplastic elastomeric copolymer may include a pseudo-bicontinuous morphology of polymer blends, such as polystyrene (PS) and/or polyisoprene (PI). In a more specific example, the thermoplastic elastomeric copolymer may include a triblock copolymer of polystyrene-block-polyisoprene-block-polystyrene (SIS). The thermally conductive nanoparticle may be non-electrically conductive. The thermally conductive nanoparticle may include 2D boron nitride (BN). The thermally conductive nanoparticle may include a metallic filler material such as gold (Au).