An epoxy resin composition comprising an epoxy resin, a curing agent, (A) a carboxyl-containing benzotriazole derivative, and (B) an alkoxysilyl-containing aminoalkylsilane derivative is suited for encapsulating semiconductor devices. The sum of (A)+(B) is 0.5-5.0 pbw per 100 pbw of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) is 0.5-1.5. The composition is free of sulfur and highly adhesive to metal substrates.

A protective coating, comprising a binder component mixture having a reactive mixture portion and a filler mixture portion, wherein the reactive mixture portion includes an epoxy resin part and an epoxy silane part, wherein the epoxy silane part is present in an amount of about 10 wt % of the reactive mixture portion and about 40 wt % of the reactive mixture portion; and a curing component having one or more amine curing compounds, wherein the amine curing compound of the curing component comprises an unmodified diamino cyclohexane (DACH) that is present in an amount between about 70 wt % and about 100 wt % of the curing component.

A protective coating, comprising a binder component mixture having a reactive mixture portion and a filler mixture portion, wherein the reactive mixture portion includes an epoxy resin part and an epoxy silane part, wherein the epoxy silane part is present in an amount of about 10 wt % of the reactive mixture portion and about 40 wt % of the reactive mixture portion; and a curing component having one or more amine curing compounds, wherein the amine curing compound of the curing component comprises an unmodified diamino cyclohexane (DACH) that is present in an amount between about 70 wt % and about 100 wt % of the curing component.

A protective coating, comprising a binder component mixture having a reactive mixture portion and a filler mixture portion, wherein the reactive mixture portion includes an epoxy resin part and an epoxy silane part, wherein the epoxy silane part is present in an amount of about 10 wt % of the reactive mixture portion and about 40 wt % of the reactive mixture portion; and a curing component having one or more amine curing compounds, wherein the amine curing compound of the curing component comprises an unmodified diamino cyclohexane (DACH) that is present in an amount between about 70 wt % and about 100 wt % of the curing component.

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm.sup.3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including a solid epoxy resin that is a solid at normal temperature and a liquid epoxy resin that is a liquid at normal temperature, (B) 500 to 1800 parts by mass of metal particles that have a tap density of 5.3 to 6.5 g/cm.sup.3 with respect to 100 parts by mass of the binder component (A), (C) 0.3 to 40 parts by mass of a curing agent that contains at least one imidazole type curing agent with respect to 100 parts by mass of the binder component (A), and (D) 150 to 600 parts by mass of a solvent with respect to 100 parts by mass of the binder component (A).

In one aspect, a coating for protecting a component exposed to a corrosive environment includes an epoxy phenolic resin and graphene nanoplatelets. In another aspect, a method of protecting a an article exposed to a corrosive environment includes applying a corrosion-resistant epoxy phenolic coating to a surface of the article exposed to a corrosive environment and curing the corrosion-resistant epoxy phenolic coating. The coating comprises 0.1 to 2.0 weight percent graphene nanoplatelets containing 5 to 15 atomic percent oxygen.

A detection device for detecting a marker in a liquid, comprising a reaction chamber, provided with a thermosensitive sensor, wherein said reaction chamber comprises an photopolymer capable of releasing or generating a chemical species that is capable of undergoing or initiating an exothermic or endothermic chemical reaction with a marker present in the liquid.

A detection device for detecting a marker in a liquid, comprising a reaction chamber, provided with a thermosensitive sensor, wherein said reaction chamber comprises an photopolymer capable of releasing or generating a chemical species that is capable of undergoing or initiating an exothermic or endothermic chemical reaction with a marker present in the liquid.

A solid epoxy composition comprising: a high heat epoxy compound of one or more of formulas (I) to (IX) provided herein; and an amorphous epoxy compound, wherein the solid epoxy composition has a single glass transition temperature from 35 C. to 100 C., preferably from 40 C. to 95 C., wherein the solid epoxy composition exhibits no other glass transition temperature or crystalline melting point from 20 C. to 200 C., and wherein R.sup.1, R.sup.2, R.sup.a, R.sup.b, R.sup.13, R.sup.14, p, q, c, and t are as provided herein.