The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.

The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.

The resin composition includes: an epoxy resin as Component (A); a phenolic compound as Component (B); and an imidazole compound having a triazine skeleton, as Component (C). A cured product of the resin composition has a glass transition temperature of 260 C. or more.

The resin composition includes: an epoxy resin as Component (A); a phenolic compound as Component (B); and an imidazole compound having a triazine skeleton, as Component (C). A cured product of the resin composition has a glass transition temperature of 260 C. or more.

In one aspect, a coating for protecting a component exposed to a corrosive environment includes an epoxy phenolic resin, a non-chromated corrosion inhibitor pigment additive and a dispersing agent. In another aspect, a method of protecting an article exposed to a corrosive environment includes applying a corrosion-resistant epoxy phenolic coating to a surface of the article exposed to a corrosive environment and curing the corrosion-resistant epoxy phenolic coating. The epoxy phenolic coating contains up to 15 percent by volume of a non-chromated corrosion inhibitor pigment additive having a particle size less than 10 micrometers.

In one aspect, a coating for protecting a component exposed to a corrosive environment includes an epoxy phenolic resin and graphene nanoplatelets. In another aspect, a method of protecting a an article exposed to a corrosive environment includes applying a corrosion-resistant epoxy phenolic coating to a surface of the article exposed to a corrosive environment and curing the corrosion-resistant epoxy phenolic coating. The coating comprises 0.1 to 2.0 weight percent graphene nanoplatelets containing 5 to 15 atomic percent oxygen.

A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

An anti-icing coating can include an amphiphlic copolymer o a surface of an article.

A composition for a semiconductor encapsulant includes an epoxy resin, a curing agent, a filler, and a polyrotaxane, wherein the polyrotaxane includes a linear polymer A, an end group B, and a cyclic molecule C threaded through by the linear polymer. The cyclic molecule C has at least one functional group selected from the group consisting of an epoxy group, an oxetane group, and an alkoxysilyl group, or has a functional group capable of reacting with the at least one functional group.