Coating compositions for coating an oilfield operational component, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of the oilfield operational component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

Coating compositions for coating an oilfield operational component, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of the oilfield operational component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

A protective film-forming composition excelling in preservation stability and having a favorable masking (protection) function against wet etching solutions when processing a semiconductor substrate, a protective film manufactured by using the composition, a substrate with a resist pattern, and a method for manufacturing a semiconductor device. The protective film-forming composition provides protection against wet etching solutions for semiconductors and contains: a polymer having a unit structure represented by Formula (1-1): Ar represents a benzene ring, a naphthalene ring, or an anthracene ring; R.sup.1 represents a hydroxy group, a mercapto group; n1 represents an integer from 0-3; n2 represents 1 or 2; L.sup.1 represents a single bond or an alkylene group that has 1-10 carbons; E represents an epoxy group; when n2=1, T.sup.1 represents an alkylene group that has 1-10 carbons; and when n2=2, T.sup.1 represents a nitrogen atom or an amide bond.

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A protective film-forming composition excelling in preservation stability and having a favorable masking (protection) function against wet etching solutions when processing a semiconductor substrate, a protective film manufactured by using the composition, a substrate with a resist pattern, and a method for manufacturing a semiconductor device. The protective film-forming composition provides protection against wet etching solutions for semiconductors and contains: a polymer having a unit structure represented by Formula (1-1): Ar represents a benzene ring, a naphthalene ring, or an anthracene ring; R.sup.1 represents a hydroxy group, a mercapto group; n1 represents an integer from 0-3; n2 represents 1 or 2; L.sup.1 represents a single bond or an alkylene group that has 1-10 carbons; E represents an epoxy group; when n2=1, T.sup.1 represents an alkylene group that has 1-10 carbons; and when n2=2, T.sup.1 represents a nitrogen atom or an amide bond.

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The present document describes a composition for the pretreatment of surfaces, which comprises plasticizers, degassers, pH adjusting agents, pigments, a phenol formaldehyde resin based adhesive, process of making the same and method of using the same.

The present document describes a composition for the pretreatment of surfaces, which comprises plasticizers, degassers, pH adjusting agents, pigments, a phenol formaldehyde resin based adhesive, process of making the same and method of using the same.

The present invention proposes an expandable powder coating composition for formation of a coating layer on a metallic article, comprising epoxy resin and a curing agent for curing said epoxy resin, wherein said expandable powder coating composition further comprises heat expandable polymeric microstructures with a weight ratio within the range of 0.5-10% (w/w) with respect to the total mass of the expandable powder coating composition, said heat expandable polymeric microstructures having a shell comprising a thermoplastic, encapsulating a fluid core and the glass transition temperature of said thermoplastic is within the range of 90 to 180° C. The present invention further proposes a method for powder coating on a metallic article.

Coating compositions for coating an oilfield operational component, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of the oilfield operational component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

Coating compositions for coating an oilfield operational component, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of the oilfield operational component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa.Math.s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.