A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I):

##STR00001##

X is an oxygen, sulfur, or nitrogen; R.sup.1 is an alkyl group, an aryl group, or an alkylaryl group; R.sup.2, R.sup.3, and R.sup.4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R.sup.5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R.sup.3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R.sup.3 and the adjacent nitrogen, m is 1.

A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent:

##STR00001##

(wherein R.sub.1 is a C.sub.1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)

A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent:

##STR00001##

(wherein R.sub.1 is a C.sub.1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)

Methods and systems for coating metal substrates are provided. The methods and systems include application of TGIC-reactive carboxyl-functional polyester resins with high acid number formulated to cure at low temperatures of 120 C. to 135 C.

Methods and systems for coating metal substrates are provided. The methods and systems include application of TGIC-reactive carboxyl-functional polyester resins with high acid number formulated to cure at low temperatures of 120 C. to 135 C.

A thermosetting resin composition includes an epoxy compound having an isocyanuric acid ring represented by the following formula (1), and a solid lubricant. ##STR00001##

A thermosetting resin composition includes an epoxy compound having an isocyanuric acid ring represented by the following formula (1), and a solid lubricant. ##STR00001##

A thermosetting resin composition includes an epoxy compound having an isocyanuric acid ring represented by the following formula (1), and a solid lubricant. ##STR00001##

There is provided a thermosetting resin composition including: an epoxy compound having an isocyanuric acid ring represented by the following formula (1); a solid lubricant; and a dicyanate compound, or the dicyanate compound and a bismaleimide compound. ##STR00001##

There is provided a thermosetting resin composition including: an epoxy compound having an isocyanuric acid ring represented by the following formula (1); a solid lubricant; and a dicyanate compound, or the dicyanate compound and a bismaleimide compound. ##STR00001##