The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.

The invention provides highly functional epoxy resins that may be used themselves in coating formulations and applications but which may be further functionalized via ring-opening reactions of the epoxy groups yielding derivative resins with other useful functionalities. The highly functional epoxy resins are synthesized from the epoxidation of vegetable or seed oil esters of polyols having 4 or more hydroxyl groups/molecule. In one embodiment, the polyol is sucrose and the vegetable or seed oil is selected from corn oil, castor oil, soybean oil, safflower oil, sunflower oil, linseed oil, tall oil fatty acid, tung oil, vernonia oil, and mixtures thereof. Methods of making of the epoxy resin and each of its derivative resins are disclosed as are coating compositions and coated objects using each of the resins.

Embodiments of this invention are directed to bio-based epoxy compositions. and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives. or composites.

Embodiments of this invention are directed to bio-based epoxy compositions. and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives. or composites.

This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288 C. soldering test and 2 hours pressure cooking test.

This invention provides a new dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin with excellent heat resistance, low dielectric constant Dk, low dissipation factor Df having the formula 1. Preparation of dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin in two steps: Step 1, reacting (a1) dicyclopentadiene phenol resin represented by formula 2 with (a2) 2,6-dimethyl phenol in the presence of acid catalyst by (a3) aldehyde compounds to synthesize dicyclopentadiene phenol-2,6-dimethyl phenol copolymer, and Step 2, reacting dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer with excess epichlorhydrin under NaOH condition to prepare dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin. When this dicyclopentadiene phenol and 2,6-dimethyl phenol copolymer epoxy resin according to the present invention is substituted into compositions for laminate, they have low dielectric constant, low dissipation factor, and no delamination after longer than 10 minutes 288 C. soldering test and 2 hours pressure cooking test.

A nanometal ink capable of forming a metal film that exhibits good adhesion to a substrate and has low resistance. The nanometal ink is a baking-type nanometal ink, and contains metal nanoparticles, a polymerizable compound, a polymerization reaction initiator, a volatile liquid medium, and a dispersant. The polymerization reaction initiator is to be activated by the action of heat and/or light, to allow polymerization of the polymerizable compound to proceed. The dispersant includes a C.sub.6-14 alkylamine.

A nanometal ink capable of forming a metal film that exhibits good adhesion to a substrate and has low resistance. The nanometal ink is a baking-type nanometal ink, and contains metal nanoparticles, a polymerizable compound, a polymerization reaction initiator, a volatile liquid medium, and a dispersant. The polymerization reaction initiator is to be activated by the action of heat and/or light, to allow polymerization of the polymerizable compound to proceed. The dispersant includes a C.sub.6-14 alkylamine.

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness. The present invention relates to a photosensitive resin composition that includes components as follows: (A) a cationically polymerizable compound at least including a compound containing an alicyclic epoxy group and devoid of ester bonds; (B) a photo-cationic polymerization initiator including a cationic moiety and an anionic moiety containing a boron atom; and (C) a light-shielding material.

An epoxy resin composition for interlayer insulation, a resin sheet for interlayer insulation, a laminate for a circuit board, a metal-based circuit board, and a power module which realize an excellent adhered-state heat resistance and which allow for the retention of good voltage resistance at a high level are provided. An epoxy resin composition for interlayer insulation according to an embodiment of the present invention contains an epoxy resin, an epoxy-modified polybutadiene compound, and an aromatic amine compound. The epoxy-modified polybutadiene compound contains a repeating unit represented by the general formula (I), a repeating unit represented by the general formula (II), and a repeating unit represented by the general formula (III), and contains at least one of a repeating unit represented by the general formula (i), a repeating unit represented by the general formula (ii), and a repeating unit represented by the general formula (iii):

##STR00001##