A resist composition contains a resin including a structural unit having an acid-labile group, a photosensitive agent, and an acid generator. The acid generator contains a compound in which a maximum molar absorption coefficient in the wavelength range of 355 to 375 nm is 6,000 (L/(mol.Math.cm)) or less The content of the photosensitive agent is 10% by mass or less in the solid content of the resist composition. When a film is formed from the resist composition with the film thickness used, a minimum transmittance of radiation of the film in the wavelength range of 355 to 375 nm is 23% or more. Also described are a method for producing a resist pattern, and a method for producing a plated molded article.

A surface sealant or jointing material composition contains at least 20 wt. % of a silane-terminated polymer, the polymer backbone of which is selected from a polycarbonate, a polyester, a copolymer containing a polyester and/or a polycarbonate and a polymer containing at least one ester group and/or carbonate group. This backbone contains a plurality of diol monomer at least 60% of which contain a diol of formula HOZOH, wherein Z is a saturated or unsaturated hydrocarbon chain optionally containing one or more heteroatoms selected from oxygen, sulfur and a tertiary nitrogen, Z includes at least one side chain and/or at least one cyclic ring system and/or at least one double bond and the composition is free from hardening catalysts or residues thereof selected from base catalysts having a pKa value greater than 15 and from by-products that may arise by cleaving of a leaving group with silane termination of the polymer.