The present disclosure relates to selective laser sintering printing and thermally conductive polymers used therein. Also described are processes for forming an article using selective laser sintering techniques.

Particles may be produced that comprise an unsaturated polyamide and an initiator. Said particles may be used in additive manufacturing methods that comprise: depositing the particles optionally in combination with other thermoplastic polymer particles upon a surface; and once deposited, heating at least a portion of the particles to promote consolidation thereof and crosslinking of the unsaturated polyamide, thereby forming a consolidated body comprising a crosslinked polyamide.

Particles may be produced that comprise an unsaturated polyamide and an initiator. Said particles may be used in additive manufacturing methods that comprise: depositing the particles optionally in combination with other thermoplastic polymer particles upon a surface; and once deposited, heating at least a portion of the particles to promote consolidation thereof and crosslinking of the unsaturated polyamide, thereby forming a consolidated body comprising a crosslinked polyamide.

Provided is a polybenzoxazole having a structural unit represented by General Formula [1]. In General Formula [1], R.sup.1 is a tetravalent organic group represented by General Formula [2], and R.sup.2 is a divalent organic group. In General Formula [2], two n’s are each independently an integer of 0 to 3, in a case where a plurality of R.sup.3′s are present, the plurality of R.sup.3′s each independently represent a monovalent substituent, and *1, *2, *3, and *4 each independently represent a bonding site, in which one of *1 and *2 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1], and one of *3 and *4 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1].

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Provided is a polybenzoxazole having a structural unit represented by General Formula [1]. In General Formula [1], R.sup.1 is a tetravalent organic group represented by General Formula [2], and R.sup.2 is a divalent organic group. In General Formula [2], two n’s are each independently an integer of 0 to 3, in a case where a plurality of R.sup.3′s are present, the plurality of R.sup.3′s each independently represent a monovalent substituent, and *1, *2, *3, and *4 each independently represent a bonding site, in which one of *1 and *2 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1], and one of *3 and *4 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1].

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A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.

A protective film forming agent for plasma dicing which can favorably form an opening (processed groove) of a desired shape by irradiation of a laser beam, at a desired position of the protective film, upon producing semiconductor chips by cutting a semiconductor substrate by plasma dicing, and a method for producing a semiconductor chip using this protective film forming agent. The protective film forming agent comprises a water-soluble resin, a light absorber, and a solvent, and a weight loss rate when the temperature is raised to 500° C. in thermogravimetry of the water-soluble resin is at least 80 weight %.

Films including solvent barriers and primer layers are described. In particular, films including a substrate, the substrate including polylactic acid, a primer layer disposed on the substrate, a barrier layer disposed on the surface of the primer layer opposite the substrate, and an adhesive layer disposed on a surface of the barrier layer opposite the primer layer. The barrier layer includes an amorphous aliphatic polyamide with a glass transition temperature of at least 40 #C. Such films can provide acceptable adhesion and barrier performance to polylactic acid based graphics film systems.

The present invention relates to a sinter powder (SP) comprising a first polyamide component (PA1) and a second polyamide component (PA2), where the melting point of the second polyamide component (PA2) is higher than the melting point of the first polyamide component (PA1). The present invention further relates to a method of producing a shaped body by sintering the sinter powder (SP) or by an FFF (fused filament fabrication) method, and to a shaped body obtainable by the methods of the invention. The present invention further relates to a method of producing the sinter powder (SP).

The present invention relates to a sinter powder (SP) comprising a first polyamide component (PA1) and a second polyamide component (PA2), where the melting point of the second polyamide component (PA2) is higher than the melting point of the first polyamide component (PA1). The present invention further relates to a method of producing a shaped body by sintering the sinter powder (SP) or by an FFF (fused filament fabrication) method, and to a shaped body obtainable by the methods of the invention. The present invention further relates to a method of producing the sinter powder (SP).