A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about 5 to about 5, and a coordinate b value of about 5 to about 5 in a CIELab color space.

A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about 5 to about 5, and a coordinate b value of about 5 to about 5 in a CIELab color space.

The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300? C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300? C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.

Disclosed herein is a coating composition having excellent thermal resistance and drying processability, utilizing polyamic acid having high thermal resistance and excellent solubility in a low boiling point solvent. Specifically, the coating composition includes polyamic acid and a low boiling point solvent having a boiling point less than 150 C. Also, disclosed herein a separator having improved thermal resistance by coating the coating composition on one or both surfaces of a polyolefin-based substrate film, and an electrochemical battery having improved thermal stability by using the separator.

Disclosed herein is a coating composition having excellent thermal resistance and drying processability, utilizing polyamic acid having high thermal resistance and excellent solubility in a low boiling point solvent. Specifically, the coating composition includes polyamic acid and a low boiling point solvent having a boiling point less than 150 C. Also, disclosed herein a separator having improved thermal resistance by coating the coating composition on one or both surfaces of a polyolefin-based substrate film, and an electrochemical battery having improved thermal stability by using the separator.

An object of the present invention is to provide an improved partial discharge-resistant electrical insulating resin composition that can inhibit deterioration of an insulator due to partial discharge. The partial discharge-resistant electrical insulating resin composition of the present invention comprises boehmite alumina and a resin.

An object of the present invention is to provide an improved partial discharge-resistant electrical insulating resin composition that can inhibit deterioration of an insulator due to partial discharge. The partial discharge-resistant electrical insulating resin composition of the present invention comprises boehmite alumina and a resin.

Solvent resistant, transparent films prepared from solutions of aromatic polyamides and multi-functional carboxylic acids in polar aprotic solvents are described herein. Solvent resistance is achieved by heating the films for a short time above 300 C. near the polyamide Tg. The films have CTEs less than 40 ppm/ C. and are optically clear displaying transmittance above 75% between 400 and 750 nm. The films are useful as substrates for flexible electronic devices.

A method of manufacturing a composite film, the method including: a coating step including coating a coating liquid containing a resin on one surface or both surfaces of a porous substrate to form a coating layer; a solidification step including solidifying the resin by bringing the coating layer into contact with a solidifying liquid to obtain a composite film including the porous substrate and a porous layer that is formed on one surface or both surfaces of the porous substrate and that includes the resin; a water washing step including washing the composite film with water; and a drying step including drying by removing water from the composite film while transporting the composite film at a transport speed of 30 m/min or more using a drying apparatus including a drying device including a contact type heating device and a hot air blowing device, wherein the composite film is brought into contact with a contact type heating device as well as exposed to hot air blown from a hot air blowing device, to remove water from the composite film being performed by bringing.