Patent classifications
C09D177/10
METHOD OF MANUFACTURING COMPOSITE FILM
A method of manufacturing a composite film, the method including: a coating step including coating a coating liquid containing a resin on one surface or both surfaces of a porous substrate to form a coating layer; a solidification step including solidifying the resin by bringing the coating layer into contact with a solidifying liquid to obtain a composite film including the porous substrate and a porous layer that is formed on one surface or both surfaces of the porous substrate and that includes the resin; a water washing step including washing the composite film with water; and a drying step including drying by removing water from the composite film while transporting the composite film at a transport speed of 30 m/min or more using a drying apparatus including a drying device including a contact type heating device and a hot air blowing device, wherein the composite film is brought into contact with a contact type heating device as well as exposed to hot air blown from a hot air blowing device, to remove water from the composite film being performed by bringing.
METHOD OF MANUFACTURING COMPOSITE FILM
A method of manufacturing a composite film, the method including: a coating step including coating a coating liquid containing a resin on one surface or both surfaces of a porous substrate to form a coating layer; a solidification step including solidifying the resin by bringing the coating layer into contact with a solidifying liquid to obtain a composite film including the porous substrate and a porous layer that is formed on one surface or both surfaces of the porous substrate and that includes the resin; a water washing step including washing the composite film with water; and a drying step including drying by removing water from the composite film while transporting the composite film at a transport speed of 30 m/min or more using a drying apparatus including a drying device including a contact type heating device and a hot air blowing device, wherein the composite film is brought into contact with a contact type heating device as well as exposed to hot air blown from a hot air blowing device, to remove water from the composite film being performed by bringing.
COMPOSITION FOR FORMING UNDERLAYER AND METHOD FOR FORMING UNDERLAYER THEREWITH
[Problem] To provide a composition for an underlayer, which can form an underlayer having flattened surface.
[Means for Solution] A composition for forming an underlayer, comprising a polymer having a repeating unit containing nitrogen and a solvent. An underlayer is formed by coating this composition on a substrate, preferably baking in an inert atmosphere, and then baking in the air containing oxygen.
Solution of aromatic polyamide for manufacturing display element, optical element, illumination element or sensor element
The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200 C. to 450 C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less.
Solution of aromatic polyamide for manufacturing display element, optical element, illumination element or sensor element
The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200 C. to 450 C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less.
POLYMER PRODUCT AND METHOD FOR SELECTIVELY METALLIZING POLYMER SUBSTRATE
A polymer product with a metal layer coated on the surface thereof is provided. The polymer product includes a polymer substrate and a metal layer formed on at least a part of a surface of the polymer substrate. The surface of the polymer substrate covered by the metal layer is formed by a polymer composition comprising a polymer and a doped tin oxide. A doping element of the doped tin oxide comprises niobium. The doped tin oxide has a coordinate L* value of about 70 to about 100, a coordinate a value of about 5 to about 5, and a coordinate b value of about 5 to about 5 in a CIELab color space.
POLYMER COMPOSITION, INK COMPOSITION AND METHOD FOR SELECTIVELY METALLIZING INSULATING SUBSTRATE
Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.
POLYMER COMPOSITION, INK COMPOSITION AND METHOD FOR SELECTIVELY METALLIZING INSULATING SUBSTRATE
Provided is a doped tin oxide that can be used as a chemical plating promoter in a method for selectively metallizing a surface of an insulating substrate. Also provided are a polymer composition that includes the doped tin oxide, a polymer molded body, an ink composition, and a method for selectively metallizing a surface of an insulating substrate. The doped tin oxide has a light color, and does not interfere with the color of the substrate while presetting thereof. The doped tin oxide has a strong ability of promoting chemical plating. Using the disclosed doped tin oxide as a chemical plating promoter, a continuous metal layer can be formed with a high plating speed, together with enhanced adhesivity between the metal layer and the insulating substrate.
COLLOIDS CONTAINING POLYARAMIDE
Colloids include a polyaramide and conductive materials, wavelength-converting materials, and/or light diffusing material. The colloid can be coated and optionally aligned on a substrate to form a film, and the film can be removed from the substrate to form a standalone film.
COLLOIDS CONTAINING POLYARAMIDE
Colloids include a polyaramide and conductive materials, wavelength-converting materials, and/or light diffusing material. The colloid can be coated and optionally aligned on a substrate to form a film, and the film can be removed from the substrate to form a standalone film.