The invention relates to thermosetting powder coating compositions as these are disclosed herein. The compositions comprise A) unsaturated resin(s) comprising ethylenic unsaturations selected from the group consisting of polyester resins, polyurethanes, epoxy resins, polyamides, polyesteramides, polycarbonates, polyureas and mixtures thereof; and B) curing agent(s) selected from the group consisting of certain vinyl urethanes, vinyl functionalized urethane resins and mixtures thereof; and C) thermal radical initiator(s) selected from the group consisting of organic peroxides, azo compounds, and mixtures thereof; and D) co-initiator(s) selected from the group consisting of certain onium compounds, sulpho-compounds, and mixtures thereof; and E) inhibitor(s) selected from the group consisting of phenolic compounds, stable radicals, catechols, phenothiazines, hydroquinones, benzoquinones and mixtures thereof. The invention further relates to a process for making said thermosetting powder coating compositions and processes for coating an article with said thermosetting powder coating compositions. The invention further relates to cured thermosetting powder coating compositions obtained by curing of the thermosetting powder coating compositions of the invention. The invention further relates to an article having coated thereon said thermosetting powder coating composition as well as to an article having coated and cured thereon said thermosetting powder coating composition. The invention further relates to the use of said thermosetting powder coating compositions, to the use of an article having coated thereon said thermosetting powder coating compositions and to the use of an article having coated and cured thereon said thermosetting powder coating compositions. The invention further relates to various uses of either the thermosetting powder coating compositions of the invention, or the cured thermosetting powder coating compositions of the invention or of articles having coated thereon the thermosetting powder coating composition of the invention, or of articles having coated and cured thereon the thermosetting powder coating composition of the invention. The invention further relates to a method for substantially lowering the T.sub.chalk-free as the latter is defined herein.

A liquid crystal polymer composition for a copper substrate with low dielectric constant and low dielectric loss suitable for use in printed circuit boards includes a solvent, a soluble liquid crystal polymer dissolved in the solvent, and a liquid crystal polymer powder dispersed in the solvent. The soluble LCP and the LCP powder form a solid content in the LCP composition. A mass ratio of the soluble LCP in the solid content of the LCP composition is in a range from 40% to 60%, and a mass ratio of the LCP powder in the solid content of the LCP composition is in a range from 40% to 60%.

A liquid crystal polymer composition for a copper substrate with low dielectric constant and low dielectric loss suitable for use in printed circuit boards includes a solvent, a soluble liquid crystal polymer dissolved in the solvent, and a liquid crystal polymer powder dispersed in the solvent. The soluble LCP and the LCP powder form a solid content in the LCP composition. A mass ratio of the soluble LCP in the solid content of the LCP composition is in a range from 40% to 60%, and a mass ratio of the LCP powder in the solid content of the LCP composition is in a range from 40% to 60%.

Oligomeric substances which contain one or more (meth)acryloyl functional groups as well as two or more amide functional groups are useful as components of compositions which may be cured using actinic irradiation to provide polymeric articles.

The present invention relates to a dispersant derived from anhydride functionalized polyester derived from carboxylic acid functionalized polyester. The anhydride functionalized polyester is then reacted with a multi-amine species forming amide and salt bonds. The technology allows lower reaction temperatures when the multi-amine species is present. The lower reaction temperature allows the use of a broader selection of polyester repeat units.

The present invention relates to a dispersant derived from anhydride functionalized polyester derived from carboxylic acid functionalized polyester. The anhydride functionalized polyester is then reacted with a multi-amine species forming amide and salt bonds. The technology allows lower reaction temperatures when the multi-amine species is present. The lower reaction temperature allows the use of a broader selection of polyester repeat units.

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.