The present invention relates to a polymer binder composition, and more specifically, to an integrated conductive polymer binder composition simultaneously having adhesion and conductivity, a method for preparing the binder composition, an energy storage device comprising the binder composition, a sensor comprising a sensing portion formed from the binder composition, and an anticorrosive coating composition comprising the binder composition as an active component.

The present invention relates to a polymer binder composition, and more specifically, to an integrated conductive polymer binder composition simultaneously having adhesion and conductivity, a method for preparing the binder composition, an energy storage device comprising the binder composition, a sensor comprising a sensing portion formed from the binder composition, and an anticorrosive coating composition comprising the binder composition as an active component.

Improved anodes and cells are provided, which enable fast charging rates with enhanced safety due to much reduced probability of metallization of lithium on the anode, preventing dendrite growth and related risks of fire or explosion. Anodes and/or electrolytes have buffering zones for partly reducing and gradually introducing lithium ions into the anode for lithiation, to prevent lithium ion accumulation at the anode electrolyte interface and consequent metallization and dendrite growth. Various anode active materials and combinations, modifications through nanoparticles and a range of coatings which implement the improved anodes are provided.

Improved anodes and cells are provided, which enable fast charging rates with enhanced safety due to much reduced probability of metallization of lithium on the anode, preventing dendrite growth and related risks of fire or explosion. Anodes and/or electrolytes have buffering zones for partly reducing and gradually introducing lithium ions into the anode for lithiation, to prevent lithium ion accumulation at the anode electrolyte interface and consequent metallization and dendrite growth. Various anode active materials and combinations, modifications through nanoparticles and a range of coatings which implement the improved anodes are provided.

A curable benzoxazine composition is described wherein the benzoxazine is derived from an aryl amine having a b.p.>200° C. The curable compositions are more thermally stable and have reduced weight loss and by-products upon cure.

The present invention provides an adhesive film hardly suffering from fisheyes and deposition of dirt and dusts thereonto and having excellent mechanical strength and heat resistance as well as good adhesion properties, which can be suitably used as various surface protective films, etc. The present invention relates to an adhesive film comprising a polyester film and an adhesive layer formed on at least one surface of the polyester film, in which the adhesive layer comprises a resin having a glass transition point of not higher than 0° C., and an antistatic agent, and a thickness of the adhesive layer is not more than 10 μm.

A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.

A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.

The present invention provides a conductive polymer composition which contains (A) a polyaniline-based conductive polymer having a repeating unit represented by the general formula (1), (B) a polyanion, and (C) a betaine compound, ##STR00001##
wherein R.sup.A1 to R.sup.A4 independently represent a hydrogen atom, a halogen atom, or a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms and optionally containing a heteroatom; and R.sup.A1 and R.sup.A2, or R.sup.A3 and R.sup.A4 may be bonded to each other to form a ring. There can be provided a conductive polymer composition that has excellent antistatic performance and applicability, does not adversely affect a resist, and can be suitably used in lithography using electron beam or the like.

The present invention provides a conductive polymer composition which contains (A) a polyaniline-based conductive polymer having a repeating unit represented by the general formula (1), (B) a polyanion, and (C) a betaine compound, ##STR00001##
wherein R.sup.A1 to R.sup.A4 independently represent a hydrogen atom, a halogen atom, or a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms and optionally containing a heteroatom; and R.sup.A1 and R.sup.A2, or R.sup.A3 and R.sup.A4 may be bonded to each other to form a ring. There can be provided a conductive polymer composition that has excellent antistatic performance and applicability, does not adversely affect a resist, and can be suitably used in lithography using electron beam or the like.