This invention discloses spray-based methods for generating polymer-based coatings with a range of morphologies, chemical reactivities, and physical stabilities useful for a broad range of applications, such as for the fabrication of non-wetting and slippery surfaces. Certain embodiments of this invention provide coatings with nanoscale morphologies, physical stabilities, and chemical reactivities that are similar to or improved compared to analogous coatings and materials made using conventional dip coating or flow-based methods. These spray-based methods can also be used to fabricate coatings with substantially similar functional properties, but with improved consistency, efficiency, additional functionality, and reproducibility. In an aspect of the invention, two or more chemically reactive polymer solutions are sprayed onto a substrate to form a crosslinked polymer coating on the substrate. The polymer solutions may be applied to the substrate sequentially or simultaneously.

[Problem]

To provide such a composition for producing a sacrifice layer as has excellent properties in both heat resistance and storage stability, and also to provide a process for producing a semiconductor device using the composition.

[Solution]

Disclosed is a composition for producing a sacrifice layer. The composition comprises a solvent and a polymer having a repeating unit containing a nitrogen atom with a lone pair, and contains particular transition metals only in a very low content. Also disclosed is a process using the composition as a sacrificial material for producing a semiconductor device comprising a porous material.

[Problem]

To provide such a composition for producing a sacrifice layer as has excellent properties in both heat resistance and storage stability, and also to provide a process for producing a semiconductor device using the composition.

[Solution]

Disclosed is a composition for producing a sacrifice layer. The composition comprises a solvent and a polymer having a repeating unit containing a nitrogen atom with a lone pair, and contains particular transition metals only in a very low content. Also disclosed is a process using the composition as a sacrificial material for producing a semiconductor device comprising a porous material.

A compound of the formula: (I) wherein: R.sup.1 is selected from H, an alkyl group, an aryl group, and combinations thereof; R.sup.2 is R.sup.f—Y—(CH.sub.2)X—; R.sup.3 is a reactive group; R.sup.f is a perfluorinated alkyl group; Y is selected from a bond, S(O).sub.2—N(CH.sub.3)—, —S(O).sub.2—N(CH.sub.2CH.sub.3)—, —S(O).sub.2—O— —S(O).sub.2— —C(O)—, —C(O)—S— —C(O)—O— —C(O)—NH—, —C(O)—N(CH.sub.3)—, —C(O)—N(CH.sub.2CH.sub.3)—, —(CH.sub.2CH.sub.2O)y-, —O—, and —O—C(O)—CH═CH—C(O)—O—; n is greater than 10; x is 2 to 20; and y is at least 1. ##STR00001##

A compound of the formula: (I) wherein: R.sup.1 is selected from H, an alkyl group, an aryl group, and combinations thereof; R.sup.2 is R.sup.f—Y—(CH.sub.2)X—; R.sup.3 is a reactive group; R.sup.f is a perfluorinated alkyl group; Y is selected from a bond, S(O).sub.2—N(CH.sub.3)—, —S(O).sub.2—N(CH.sub.2CH.sub.3)—, —S(O).sub.2—O— —S(O).sub.2— —C(O)—, —C(O)—S— —C(O)—O— —C(O)—NH—, —C(O)—N(CH.sub.3)—, —C(O)—N(CH.sub.2CH.sub.3)—, —(CH.sub.2CH.sub.2O)y-, —O—, and —O—C(O)—CH═CH—C(O)—O—; n is greater than 10; x is 2 to 20; and y is at least 1. ##STR00001##

A mineral-compatible cationic emulsion composition with polymer stabilizers, and methods for utilizing same in paving and other applications is disclosed. In one aspect, a bitumen-in-water emulsion composition includes at least one bitumen material, at least one polymer stabilizer, at least one emulsifier, and water, where the emulsifier is a cationic surfactant, an amphoteric surfactant, or a mixture of both, and the polymer stabilizer is a natural or synthetic cationic polymer consisting of alkylene polyamines, alkyl polyamines, polyquaternary polymers, polyvinylamine, polyvinylimidazoline, polyester polyquaternary polymers, polyether polyquaternary polymers, or mixtures thereof. The inclusion of polymer stabilizer in the cationic emulsion increases the stability of the emulsion and increases the compatibility of the cationic emulsion with negatively charged minerals.

A mineral-compatible cationic emulsion composition with polymer stabilizers, and methods for utilizing same in paving and other applications is disclosed. In one aspect, a bitumen-in-water emulsion composition includes at least one bitumen material, at least one polymer stabilizer, at least one emulsifier, and water, where the emulsifier is a cationic surfactant, an amphoteric surfactant, or a mixture of both, and the polymer stabilizer is a natural or synthetic cationic polymer consisting of alkylene polyamines, alkyl polyamines, polyquaternary polymers, polyvinylamine, polyvinylimidazoline, polyester polyquaternary polymers, polyether polyquaternary polymers, or mixtures thereof. The inclusion of polymer stabilizer in the cationic emulsion increases the stability of the emulsion and increases the compatibility of the cationic emulsion with negatively charged minerals.

A mineral-compatible cationic emulsion composition with polymer stabilizers, and methods for utilizing same in paving and other applications is disclosed. In one aspect, a bitumen-in-water emulsion composition includes at least one bitumen material, at least one polymer stabilizer, at least one emulsifier, and water, where the emulsifier is a cationic surfactant, an amphoteric surfactant, or a mixture of both, and the polymer stabilizer is a natural or synthetic cationic polymer consisting of alkylene polyamines, alkyl polyamines, polyquaternary polymers, polyvinylamine, polyvinylimidazoline, polyester polyquaternary polymers, polyether polyquaternary polymers, or mixtures thereof. The inclusion of polymer stabilizer in the cationic emulsion increases the stability of the emulsion and increases the compatibility of the cationic emulsion with negatively charged minerals.

Described herein are patterned superhydrophobic surfaces, substrates, devices, and systems including the patterned superhydrophobic surfaces, and methods of making and uses thereof.

Described herein are patterned superhydrophobic surfaces, substrates, devices, and systems including the patterned superhydrophobic surfaces, and methods of making and uses thereof.