C09D179/04

ADHESIVE FILM AND PROCESS FOR PRODUCING THE SAME
20170283667 · 2017-10-05 ·

The present invention provides an adhesive film hardly suffering from fisheyes and deposition of dirt and dusts thereonto and having excellent mechanical strength and heat resistance as well as good adhesion properties, which can be suitably used as various surface protective films, etc. The present invention relates to an adhesive film comprising a polyester film and an adhesive layer formed on at least one surface of the polyester film, in which the adhesive layer comprises a resin having a glass transition point of not higher than 0° C., and an antistatic agent, and a thickness of the adhesive layer is not more than 10 μm.

PARTICULATE POLY(PHENYLENE ETHER)-CONTAINING VARNISH COMPOSITION, COMPOSITE AND LAMINATE PREPARED THEREFROM, AND METHOD OF FORMING COMPOSITE
20170247566 · 2017-08-31 ·

A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

PARTICULATE POLY(PHENYLENE ETHER)-CONTAINING VARNISH COMPOSITION, COMPOSITE AND LAMINATE PREPARED THEREFROM, AND METHOD OF FORMING COMPOSITE
20170247566 · 2017-08-31 ·

A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.

Film-forming composition

A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker. ##STR00001##

Film-forming composition

A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker. ##STR00001##

Film-forming composition

A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker. ##STR00001##

Polybenzimidazole/polyvinylbutyral mixtures

The polymer mixture comprises polybenzimidazole (PBI)/polyvinylbutyral (PVB). The weight ratio (PVB:PBI) of this mixture may range from 0.25-50:50-99.75 or 15-85:15-85. The coating is based upon the polymer mixture.

Polybenzimidazole/polyvinylbutyral mixtures

The polymer mixture comprises polybenzimidazole (PBI)/polyvinylbutyral (PVB). The weight ratio (PVB:PBI) of this mixture may range from 0.25-50:50-99.75 or 15-85:15-85. The coating is based upon the polymer mixture.

Polybenzimidazole/polyvinylbutyral mixtures

The polymer mixture comprises polybenzimidazole (PBI)/polyvinylbutyral (PVB). The weight ratio (PVB:PBI) of this mixture may range from 0.25-50:50-99.75 or 15-85:15-85. The coating is based upon the polymer mixture.

COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY AND PATTERN FORMING METHOD

The composition for forming an underlayer film for lithography according to the present invention contains a compound represented by a specific formula (1) and 20 to 99% by mass of a solvent component (S), in which 27 to 100% by mass of the compound represented by the formula (1) is included in a component (A) other than the solvent component (S).