Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

An anti-reflective film includes a hard coating layer including a curable resin, and a low-refractive layer disposed on the hard coating layer and including the curable resin, wherein a pencil hardness measured on the low-refractive layer is equal to or greater than 3H, thereby achieving excellent durability and anti-reflective effects. Also, provided is a display device employing the anti-reflective film.

An anti-reflective film includes a hard coating layer including a curable resin, and a low-refractive layer disposed on the hard coating layer and including the curable resin, wherein a pencil hardness measured on the low-refractive layer is equal to or greater than 3H, thereby achieving excellent durability and anti-reflective effects. Also, provided is a display device employing the anti-reflective film.

A compound is provided, having the formula (I), wherein R.sub.S is a soft block polymer; wherein each T is independently a urethane or urea linkage; see formulae (A) and (B); wherein each R.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, or —CH.sub.2CH.sub.2CH.sub.2CH.sub.3; wherein each R′.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.2CH.sub.3, or —OR.sub.D; and wherein each p is independently 1, 2, or 3. Compositions containing the compound, and methods of making and using the compound are provided. ##STR00001##

A compound is provided, having the formula (I), wherein R.sub.S is a soft block polymer; wherein each T is independently a urethane or urea linkage; see formulae (A) and (B); wherein each R.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, or —CH.sub.2CH.sub.2CH.sub.2CH.sub.3; wherein each R′.sub.D is independently —CH.sub.3, —CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.3, —CH.sub.2CH.sub.2CH.sub.2CH.sub.3, or —OR.sub.D; and wherein each p is independently 1, 2, or 3. Compositions containing the compound, and methods of making and using the compound are provided. ##STR00001##

Xerogels and compositions comprising xerogels comprising a transition metal oxide and silicon oxide xerogel matrix. The xerogels and compositions can be made from mixtures of transition metal alkoxide(s) and tetraalkoxysilane(s) and, optionally, alkyltrialkoxysilane(s), aminoalkyl-, alkylaminoalkyl-, dialkylaminoalkyltrialkoxysilane(s), or a combination thereof. The xerogels and compositions can be used as antifouling coatings on, for example; boats.

Xerogels and compositions comprising xerogels comprising a transition metal oxide and silicon oxide xerogel matrix. The xerogels and compositions can be made from mixtures of transition metal alkoxide(s) and tetraalkoxysilane(s) and, optionally, alkyltrialkoxysilane(s), aminoalkyl-, alkylaminoalkyl-, dialkylaminoalkyltrialkoxysilane(s), or a combination thereof. The xerogels and compositions can be used as antifouling coatings on, for example; boats.

An athermal optical waveguide structure such as an optical add drop multiplexer (OADM) or the like is fabricated by a method that includes forming a lower cladding layer on a substrate. A waveguiding core layer is formed on the lower cladding layer. An upper cladding layer is formed on the waveguiding core layer and the lower cladding layer a sol-gel material. The sol-gel material includes an organically modified siloxane and a metal oxide. A thermo-optic coefficient of the sol-gel material is adjusted by curing the sol-gel material for a selected duration of time at a selected temperature such that the thermo-optic coefficient of the sol-gel material compensates for a thermo-optic coefficient of at least the waveguiding core layer such that an effective thermo-optic coefficient of the optical waveguide structure at a specified optical wavelength and over a specified temperature range is reduced.

A resin composition including the following (A) to (D): (A) a resin containing epoxy groups in the range of 140 to 5000 g/eq as an epoxy equivalent; (B) a phenolic curing agent; (C) a curing accelerator; and (D) at least one compound selected among what is expressed by the following formulae (0-1) to (0-5). This provides a resin composition having small warpage and excellent adhesive force, a high adhesion resin composition film made into a film form from the composition, a semiconductor laminate having a cured product of the film and its production method, a semiconductor device obtained by dicing the semiconductor laminate into individual chips and its production method. ##STR00001##