Organopolysiloxane copolymers having the formula

##STR00001##

are useful in treating fibrous substances, particularly textile fabrics, to produce a laundering-resistant soft hand.

Provided are: a novel silicon-containing polymer capable of supporting a metal compound including a metal element; a film-forming composition including the silicon-containing polymer; a method for forming a coating film on the surface of an object to be treated using the film forming composition, and supporting a metal compound on the surface of the object to be treated by bringing the metal compound into contact with the coating film; an article including a coating film which contains said silicon-containing polymer and supports a metal compound; and a method for producing said silicon-containing polymer. This silicon-containing polymer contains, in a molecular chain, at least one among a polysiloxane chain or an oligosiloxane chain, and a polysilane chain or an oligosilane chain, wherein a cyano group-containing hydrocarbon group having 1-10 carbon atoms is introduced onto a silicon atom.

A composition for forming a release coating is disclosed. The composition comprises (A) the reaction product of (1) a branched organopolysiloxane including M, D and Q siloxy units and an average of at least two silicon-bonded ethylenically unsaturated groups per molecule; and (2) an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule; in the presence of a hydrosilylation catalyst. The composition further comprises (B) an organopolysiloxane having an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.

A composition for forming a release coating is disclosed. The composition comprises (A) the reaction product of (1) a branched organopolysiloxane including M, D and Q siloxy units and an average of at least two silicon-bonded ethylenically unsaturated groups per molecule; and (2) an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule; in the presence of a hydrosilylation catalyst. The composition further comprises (B) an organopolysiloxane having an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.

A siloxane compound represented by the general formula (1): ##STR00001##
where R.sup.1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R.sup.2 is a linear organosiloxy group represented by the general formula (2): ##STR00002##
where each R.sup.4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R.sup.3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

The present invention relates to a sol-gel coating composition comprising conductive fillers, intended to make a culinary article compatible with induction.

The present invention relates to a sol-gel coating composition comprising conductive fillers, intended to make a culinary article compatible with induction.

A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.

A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.

A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.