Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

A coating composition comprising inorganic oxide fine particles containing at least one element selected from the group consisting of Ti, Zr, Sn and Sb, a hydrolysable group-containing organic silicon compound, and (C1) a surfactant having an HLB value of 8 or less and (C2) a surfactant having an HLB value of more than 8, for forming a coat layer having little white turbidity, a good appearance and excellent scratch resistance, chemical resistance, hot water resistance and weather resistance on the surface of a plastic optical substrate.

A coating composition comprising inorganic oxide fine particles containing at least one element selected from the group consisting of Ti, Zr, Sn and Sb, a hydrolysable group-containing organic silicon compound, and (C1) a surfactant having an HLB value of 8 or less and (C2) a surfactant having an HLB value of more than 8, for forming a coat layer having little white turbidity, a good appearance and excellent scratch resistance, chemical resistance, hot water resistance and weather resistance on the surface of a plastic optical substrate.

Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

Low dielectric constant curable compositions include a first alkyl (meth)acrylate monomer with 12 or more carbon atoms, a crosslinking monomer, a copolymeric additive of a polycarbosilane or a polycarbosiloxane, and at least one initiator. The curable composition is solvent free and inkjet printable. Upon curing the curable composition forms a non-crystalline, optically transparent layer with a dielectric constant of less than or equal to 3.0 at 1 MegaHertz.

Polyorganosiloxanes and methods for their preparation are disclosed. The polyorganosiloxanes are useful in curable compositions. The polyorganosiloxanes may have up to 9 silicon bonded hydrogen atoms, or other curable groups, per molecule.

A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.

A resist underlayer film-forming composition including: (A) component: an isopoly or heteropoly acid, or a salt thereof, or a combination thereof; and (B) component: polysiloxan, poly hafnium oxide or zirconium oxide, or a combination thereof, wherein an amount of the (A) component is 0.1 to 85% by mass of a total amount of the (A) component and the (B) component; and polysiloxan is a hydrolysis-condensation product of hydrolyzable silane of Formula (1):
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4−(a+b)  Formula (1)
and a hydrolyzable silane whose (a+b) is 0 is contained in a proportion of 60 to 85 mol % of a total hydrolyzable silane in Formula (1); the poly hafnium oxide is a hydrolysis-condensation product of hydrolyzable hafnium of Formula (2):
Hf(R.sup.4).sub.4  Formula (2)
and the zirconium oxide is a hydrolysis-condensation product of hydrolyzable zirconium of Formula (3) or Formula (4):
Zr(R.sup.5).sub.4  Formula (3)
ZrO(R.sup.6).sub.2  Formula (4)
or a hydrolysis-condensation product of a combination thereof.