A method of producing a layer of a UV-cured silicone rubber composition on a substrate surface, including applying a primer composition to the substrate surface and hardening the primer composition followed by applying a UV-curable silicone rubber composition, and UV-curing the curable silicone rubber composition. At least one UV-sensitive crosslinking catalyst selected from compounds which initiate and promote curing of UV-curable silicone rubber compositions, is added to the silicone primer composition in any desired sequence before, during or after hardening of the silicone primer composition.

A method of producing a layer of a UV-cured silicone rubber composition on a substrate surface, including applying a primer composition to the substrate surface and hardening the primer composition followed by applying a UV-curable silicone rubber composition, and UV-curing the curable silicone rubber composition. At least one UV-sensitive crosslinking catalyst selected from compounds which initiate and promote curing of UV-curable silicone rubber compositions, is added to the silicone primer composition in any desired sequence before, during or after hardening of the silicone primer composition.

The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C.sub.1 to C.sub.30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C.sub.1 to C.sub.30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

There is provided a crosslinked siloxane composition. The crosslinked siloxane composition is a polymerization product of a mixture including from about 2 to about 12 alkoxysilane precursor materials. At least one of the alkoxysilane precursor materials is a hydrophobic alkoxysilane precursor material. In addition at least one of the alkoxysilane precursor materials is an aromatic alkoxysilane precursor material.

There is provided a layered body including a resin layer and a second layer that are stacked on one another. The resin layer is formed of a resin composition containing a fine inorganic particle composite that includes: a composite resin in which a polysiloxane segment having a structural unit represented by general formula and/or general formula and further having a silanol group and/or a hydrolyzable silyl group is bonded to a vinyl-based polymer segment through a bond represented by general formula; and fine inorganic particles that are each bonded to the composite resin at the polysiloxane segment through a siloxane bond.

There is provided a layered body including a resin layer and a second layer that are stacked on one another. The resin layer is formed of a resin composition containing a fine inorganic particle composite that includes: a composite resin in which a polysiloxane segment having a structural unit represented by general formula and/or general formula and further having a silanol group and/or a hydrolyzable silyl group is bonded to a vinyl-based polymer segment through a bond represented by general formula; and fine inorganic particles that are each bonded to the composite resin at the polysiloxane segment through a siloxane bond.

The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.

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Provided is a photosensitive resin composition comprising (A) a polymer including a silicone skeleton and (B) photo-acid generators, wherein the photo-acid generators (B) comprise (B1) a photo-acid generator which is an onium salt and (B2) a photo-acid generator which is not an onium salt.

Articles comprising: a molded substrate comprising one or more polycarbonate resins or blends of polycarbonate and polyester resins containing polydimethyl siloxanes modified with one or more of acrylate, hydroxyl or epoxy groups and disposed on the surface or a portion of the surface of the substrate is a cured silicone rubber; wherein the one or more polycarbonate resins or blends of polycarbonate and polyester resins contain the modified polydimethyl siloxanes in sufficient amount such that the peel strength is increased. Compositions comprising one or more polycarbonate resins or blends of polycarbonate and polyester resins containing polydimethyl siloxanes modified with one or more of acrylate, hydroxyl or epoxy groups in an amount of about 0.1 to less than 1.0 percent by weight. Methods for preparing the articles are disclosed.