The present disclosure provides a composition for treating leather and similar materials. The composition comprises from about 40% (w/w) to about 60% (w/w) of an oil obtained from natural sources; from about 1% (w/w) to about 15% (w/w) of a wax obtained from natural sources; and from about 20% (w/w) to about 50% (w/w) of water. The present disclosure also provides a method for treating a leather article and a process for the preparation of an emulsion composition.

A streakless car polish formulation can be applied easily, by the car owner or in a commercial setting, and does not leave any objectionable residue after application. The formulation involves a silicone emulsion and a fluorosurfactant carried in aqueous solution of alcohol and water, and may include a minor amount of sodium benzoate. The product increases the hydrophilicity of automotive painted or glass surfaces, so that water does not bead up.

The present disclosure provides a method of graphene exfoliation and/or stabilization. Both graphene and silica are mixed in an organic solvent to form a liquid precursor, which is then directed through an orifice formed by a metal cylinder and a flat metal plate. The metal cylinder is pressed against the flat metal plate by a high pressure. The high shear between the metal cylinder and the flat metal plate breaks down the thick layers of graphene to thin layers, which are stably dispersed in the gel formed by the silica.

A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 3×10.sup.1 to 1.5×10.sup.3 per mL.

Embodiments provide a polishing composition for a magnetic disc substrate including colloidal silica, a phosphorus-containing compound, a water-soluble polymer compound, and water. According to at least one embodiment, the water-soluble polymer compound is a copolymer having a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Embodiments provide a polishing composition for a magnetic disc substrate including colloidal silica, a phosphorus-containing compound, a water-soluble polymer compound, and water. According to at least one embodiment, the water-soluble polymer compound is a copolymer having a structural unit derived from an unsaturated aliphatic carboxylic acid and a structural unit derived from an unsaturated amide.

Smoothness of glass is improved. A polishing slurry (A) contains amorphous carbon and water, and a total amount of the amorphous carbon and the water is equal to or more than 90% of the whole polishing slurry in terms of mass ratio.

Smoothness of glass is improved. A polishing slurry (A) contains amorphous carbon and water, and a total amount of the amorphous carbon and the water is equal to or more than 90% of the whole polishing slurry in terms of mass ratio.

Methods for polishing dielectric layers using an auto-stop slurry in forming semiconductor devices, such as three-dimensional (3D) memory devices, are provided. For example, a stack structure is formed in a staircase region and a core array region. The stack structure includes a plurality of interleaved first material layers and second material layers. Edges of the interleaved first material layers and second material layers define a staircase structure on a side of the stack structure in the staircase region. A dielectric layer is formed over the staircase region and a peripheral region outside the stack structure. The dielectric layer includes a protrusion from the stack structure. The dielectric layer is polished using an auto-stop slurry to remove the protrusion of the dielectric layer.

A CMP slurry composition and a method of polishing a metal layer are provided. In some embodiments, the CMP slurry composition includes about 0.1 to 10 parts by weight of a metal oxide, and about 0.1 to 10 parts by weight of a chelator. The chelator includes a thiol compound or a thiolether compound.