A method of producing a layer of a UV-cured silicone rubber composition on a substrate surface, including applying a primer composition to the substrate surface and hardening the primer composition followed by applying a UV-curable silicone rubber composition, and UV-curing the curable silicone rubber composition. At least one UV-sensitive crosslinking catalyst selected from compounds which initiate and promote curing of UV-curable silicone rubber compositions, is added to the silicone primer composition in any desired sequence before, during or after hardening of the silicone primer composition.

A method of producing a layer of a UV-cured silicone rubber composition on a substrate surface, including applying a primer composition to the substrate surface and hardening the primer composition followed by applying a UV-curable silicone rubber composition, and UV-curing the curable silicone rubber composition. At least one UV-sensitive crosslinking catalyst selected from compounds which initiate and promote curing of UV-curable silicone rubber compositions, is added to the silicone primer composition in any desired sequence before, during or after hardening of the silicone primer composition.

Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

A breakaway adhesive coating system includes a substrate having a first substrate surface and a second substrate surface. A release coating is disposed over at least a portion of and bonded to the second substrate surface. A breakaway coating is disposed over a release coating surface opposite to the second substrate surface, the breakaway coating bonded to the release coating. An adhesive layer is disposed over a breakaway coating surface opposite to the release coating, the adhesive layer bonded to the breakaway coating.

A breakaway adhesive coating system includes a substrate having a first substrate surface and a second substrate surface. A release coating is disposed over at least a portion of and bonded to the second substrate surface. A breakaway coating is disposed over a release coating surface opposite to the second substrate surface, the breakaway coating bonded to the release coating. An adhesive layer is disposed over a breakaway coating surface opposite to the release coating, the adhesive layer bonded to the breakaway coating.

The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.

A laminate including a base member, and a hydrogel layer whose forming material is a hydrogel, the hydrogel layer being provided on a surface of the base member. An adhesive region and a non-adhesive region are formed at an interface between the base member and the hydrogel layer, the adhesive region being a region where the base member and the hydrogel layer adhere to each other, the non-adhesive region being a region where the base member and the hydrogel layer do not adhere to each other.

A lower part protection film for an OLED panel is provided. More particularly, a lower part protection film for an OLED panel, having a significantly improved recognition rate of an alignment process, being capable of preventing generation of static electricity through an antistatic treatment, and having excellent adhesion to an OLED panel at the same time, and an organic light-emitting display apparatus including the lower part protection film for an OLED panel are provided.

A lower part protection film for an OLED panel is provided. More particularly, a lower part protection film for an OLED panel, having a significantly improved recognition rate of an alignment process, being capable of preventing generation of static electricity through an antistatic treatment, and having excellent adhesion to an OLED panel at the same time, and an organic light-emitting display apparatus including the lower part protection film for an OLED panel are provided.