The instant invention concerns the use of at least one polymer P obtained by radical copolymerization of a mixture of (i) acrylic acid; (ii) methacrylic acid; and (iii) at least one 2-hydroxyethyl methacrylate phosphate for treating a metallic surface intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

The instant invention concerns the use of at least one polymer P obtained by radical copolymerization of a mixture of (i) acrylic acid; (ii) optionally methacrylic acid; and (iii) at least one ethylenically unsaturated monomer carrying an unsaturated heterocycle having at least two nitrogen atoms, said monomer being preferably an ethylenically unsaturated imidazole, for treating a metallic surface for treating a metallic surface intended to be coated by a paint, a varnish or an adhesive, for example intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

The instant invention concerns the use of at least one polymer P obtained by radical copolymerization of a mixture of (i) acrylic acid; (ii) optionally methacrylic acid; and (iii) at least one ethylenically unsaturated monomer carrying an unsaturated heterocycle having at least two nitrogen atoms, said monomer being preferably an ethylenically unsaturated imidazole, for treating a metallic surface for treating a metallic surface intended to be coated by a paint, a varnish or an adhesive, for example intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

A method for curing a patch. The method includes generating the patch according to a negative of a scan of a scarf in a composite material. The method also includes pre-curing the patch.

A method for curing a patch. The method includes generating the patch according to a negative of a scan of a scarf in a composite material. The method also includes pre-curing the patch.

The present disclosure provides sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent. At least one vehicle component comprises a sol-gel coating system comprising a metal substrate and a sol-gel formulation disposed on the metal substrate. The sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent.

The present disclosure provides sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent. At least one vehicle component comprises a sol-gel coating system comprising a metal substrate and a sol-gel formulation disposed on the metal substrate. The sol-gel formulation has about 10 wt % or less water content based on the total weight of the sol-gel formulation and comprises an organosilane, a metal alkoxide, an acid stabilizer, and an organic solvent.

A curable adhesive composition precursor comprising a first part (A) comprising: at least one diamine in an amount of from 10 to 50 wt.-% based on the total weight of part (A), at least one amine epoxy curing agent based on a phenolic lipid in an amount of from 10 to 50 wt.-% based on the total weight of part (A), and at least one inorganic filler material in an amount of from 10 to 60 wt.-% based on the total amount of part (A); and a second part (B) comprising: at least one first epoxy resin in an amount of from 15 to 60 wt.-% based on the total amount of part (B)), at least one viscosity modifier in an amount of from 1 to 25 wt.-%, based on the total weight of part (B), and at least one epoxy-reactive flexibilizer in an amount of from 0.1 to 10 wt.-% based on the total amount of part (B).

A curable adhesive composition precursor comprising a first part (A) comprising: at least one diamine in an amount of from 10 to 50 wt.-% based on the total weight of part (A), at least one amine epoxy curing agent based on a phenolic lipid in an amount of from 10 to 50 wt.-% based on the total weight of part (A), and at least one inorganic filler material in an amount of from 10 to 60 wt.-% based on the total amount of part (A); and a second part (B) comprising: at least one first epoxy resin in an amount of from 15 to 60 wt.-% based on the total amount of part (B)), at least one viscosity modifier in an amount of from 1 to 25 wt.-%, based on the total weight of part (B), and at least one epoxy-reactive flexibilizer in an amount of from 0.1 to 10 wt.-% based on the total amount of part (B).

Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a homopolymer or copolymer comprising a phosphorous-containing monomeric subunit, and has a pH of 1.0 to 3.0. The coating composition comprises first and second components and elastomeric particles. The first component comprises an epoxy-containing compound (E1) and/or an epoxide-functional adduct (E2). The second component comprises a diamine and/or a polyamine comprising a cyclic ring (A2) and/or an amine-functional adduct (A3). The present invention is also directed to methods of making the compositions, methods of coating a substrate, and coated substrates.