C09J5/02

SOLVENT-BASED PRETREATMENT AGENT HAVING IMPROVED ADHESION TO RESIDUAL ADHESIVE BEADS
20220348793 · 2022-11-03 · ·

A pretreatment composition for adhesive bonds, including i) between 10 and 30 parts by weight of at least one polyurethane polymer PU containing isocyanate groups, obtained from the reaction of at least one poly(meth)acrylate polyol P and at least one polyisocyanate Il, with the proviso that the poly(meth)acrylate polyol P has an OH number of at least 35 and the polyurethane polymer PU has an NCO content of between 2.0% and 25.0% by weight, based on the polyurethane polymer PU; ii) 0.1 to 10 parts by weight of at least one organosilane OS; iii) 0 to 10 parts by weight of at least one further polyisocyanate I2; iv) 60 to 90 parts by weight of a solvent L; v) 0 to 15 parts by weight of an industrial carbon black; vi) 0 to 10 parts by weight of a fumed hydrophobic silica.

SOLVENT-BASED PRETREATMENT AGENT HAVING IMPROVED ADHESION TO RESIDUAL ADHESIVE BEADS
20220348793 · 2022-11-03 · ·

A pretreatment composition for adhesive bonds, including i) between 10 and 30 parts by weight of at least one polyurethane polymer PU containing isocyanate groups, obtained from the reaction of at least one poly(meth)acrylate polyol P and at least one polyisocyanate Il, with the proviso that the poly(meth)acrylate polyol P has an OH number of at least 35 and the polyurethane polymer PU has an NCO content of between 2.0% and 25.0% by weight, based on the polyurethane polymer PU; ii) 0.1 to 10 parts by weight of at least one organosilane OS; iii) 0 to 10 parts by weight of at least one further polyisocyanate I2; iv) 60 to 90 parts by weight of a solvent L; v) 0 to 15 parts by weight of an industrial carbon black; vi) 0 to 10 parts by weight of a fumed hydrophobic silica.

Adhesion-promoting interlayer compositions containing organic titanates/zirconates and methods of use

Adhesion-promoting compositions containing organic titanates and/or organic zirconates and the use of the adhesion-promoting compositions to provide adhesion-promoting layers to enhance adhesion between metal substrates and an overlying free radical-polymerized sealant are disclosed.

METHOD AND DEVICE FOR JOINING ELEMENTS TO COMPONENTS
20230125406 · 2023-04-27 ·

A method for joining by welding a weld stud to a workpiece, with the following steps: providing a drawn arc welding device and a plasma gas cleaning device; providing a weld stud and providing a workpiece including a joining surface; cleaning the joining surface using a plasma gas cleaning method including the cleaning steps of: generating in the plasma gas generating device a non-transferred arc, generating with the non-transferred arc a plasma from a compressed gas, and directing the plasma onto the joining surface to remove contaminants thereon; and then, after the cleaning steps, joining the weld stud to the workpiece by drawn arc welding using the drawn arc welding device including forming of a transferred electric arc between the weld stud and the joining surface.

BONDED BODY OF METAL AND RESIN, AND METHOD FOR BONDING METAL AND RESIN
20230132089 · 2023-04-27 · ·

To provide a bonding technique that is capable of bonding a metal and a resin with a sufficient bonding strength. A bonded article including a functional group-carrying metal surface and a functional group-carrying resin surface, which are bonded directly to each other, the functional group-carrying metal surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a metal, the functional group-carrying resin surface having one or more kind of a functional group selected from the group consisting of an amino group, an epoxy group, a mercapto group, a styryl group, a (meth)acryloyl group, an isocyanato group, and an alkenyl group, on a surface of a resin.

Cycloolefin polymer bonding method

A cycloolefin polymer (COP) bonding method wherein a first material that is COP and a second material that is COP or glass are bonded. The method includes: a step of exposing at least a bonding surface of the first material to H.sub.2O plasma; and a step of mating the bonding surface of the first material and a bonding surface of the second material. According to the method, the cycloolefin polymer (COP) can be bonded to a target material without applying high pressure or high temperature, and without affecting the optical properties.

ALUMINUM ALLOY ARTICLES EXHIBITING IMPROVED BOND DURABILITY AND METHODS OF MAKING THE SAME

Disclosed are metal articles and methods of making and processing such metal articles. More particularly, disclosed are aluminum alloy articles exhibiting controllable surface properties, including excellent bond durability. An aluminum alloy article as described herein includes a surface having a concentration of an alloying element, and a coating having a concentration of an element capable of interacting with the alloying element. Also disclosed herein are methods of providing metal articles having excellent bond durability.

METHOD FOR ALTERING ADHESION PROPERTIES OF A SURFACE BY PLASMA COATING
20230066187 · 2023-03-02 ·

A method for altering adhesion properties of a surface of a substrate by a coating, comprising the steps of: a) ionizing a plasma gas at low temperature and at atmospheric pressure, thereby creating a plasma with a plasma temperature of at most 50° C.; b) introducing a precursor into a plasma gas afterglow of the plasma; c) subjecting the surface of the substrate to the plasma including the precursor, thereby forming a coating onto the surface. The plasma gas is essentially completely comprised of inert gas. The coating alters the adhesion properties of the surface.

METHOD FOR ALTERING ADHESION PROPERTIES OF A SURFACE BY PLASMA COATING
20230066187 · 2023-03-02 ·

A method for altering adhesion properties of a surface of a substrate by a coating, comprising the steps of: a) ionizing a plasma gas at low temperature and at atmospheric pressure, thereby creating a plasma with a plasma temperature of at most 50° C.; b) introducing a precursor into a plasma gas afterglow of the plasma; c) subjecting the surface of the substrate to the plasma including the precursor, thereby forming a coating onto the surface. The plasma gas is essentially completely comprised of inert gas. The coating alters the adhesion properties of the surface.

Polymer bonding process
11603482 · 2023-03-14 ·

The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.