The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.

An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

The present disclosure provides a process for forming a laminate. The process includes (A) uniformly applying an isocyanate component to a first substrate, the isocyanate component containing an isocyanate compound; (B) uniformly applying an isocyanate-reactive component to a second substrate, the isocyanate-reactive component containing an amine-terminated compound; (C) bringing the first substrate and the second substrate together, thereby mixing and reacting the isocyanate component and the isocyanate-reactive component to form an adhesive composition between the first substrate and the second substrate; (D) curing the adhesive composition to bond the first substrate and the second substrate; and (E) forming the laminate.

The present disclosure provides a process for forming a laminate. The process includes (A) uniformly applying an isocyanate component to a first substrate, the isocyanate component containing an isocyanate compound; (B) uniformly applying an isocyanate-reactive component to a second substrate, the isocyanate-reactive component containing an amine-terminated compound; (C) bringing the first substrate and the second substrate together, thereby mixing and reacting the isocyanate component and the isocyanate-reactive component to form an adhesive composition between the first substrate and the second substrate; (D) curing the adhesive composition to bond the first substrate and the second substrate; and (E) forming the laminate.

A method of forming a display article includes dispensing a material onto a first substrate, and pre-curing the material to form a dam. The method includes depositing a liquid optically clear adhesive in a first pattern onto the first substrate such that the first pattern is spaced apart from the dam to form a coated first substrate. The method includes depositing the adhesive in a second pattern onto a second substrate to form a coated second substrate, and flipping the coated second substrate upside down. The method includes translating the coated first and second substrates towards one another to eliminate an air gap, contacting the first pattern and the second pattern at a plurality of single points, and compressing the first pattern and the second pattern to eliminate the air gap and air entrained between the coated first and second substrates.

A method of forming a display article includes dispensing a material onto a first substrate, and pre-curing the material to form a dam. The method includes depositing a liquid optically clear adhesive in a first pattern onto the first substrate such that the first pattern is spaced apart from the dam to form a coated first substrate. The method includes depositing the adhesive in a second pattern onto a second substrate to form a coated second substrate, and flipping the coated second substrate upside down. The method includes translating the coated first and second substrates towards one another to eliminate an air gap, contacting the first pattern and the second pattern at a plurality of single points, and compressing the first pattern and the second pattern to eliminate the air gap and air entrained between the coated first and second substrates.

The instant invention concerns the use of at least one polymer P obtained by radical copolymerization of a mixture of (i) acrylic acid; (ii) methacrylic acid; and (iii) at least one 2-hydroxyethyl methacrylate phosphate for treating a metallic surface intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

The instant invention concerns the use of at least one polymer P obtained by radical copolymerization of a mixture of (i) acrylic acid; (ii) optionally methacrylic acid; and (iii) at least one ethylenically unsaturated monomer carrying an unsaturated heterocycle having at least two nitrogen atoms, said monomer being preferably an ethylenically unsaturated imidazole, for treating a metallic surface for treating a metallic surface intended to be coated by a paint, a varnish or an adhesive, for example intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

The instant invention concerns the use of at least one polymer P obtained by radical copolymerization of a mixture of (i) acrylic acid; (ii) optionally methacrylic acid; and (iii) at least one ethylenically unsaturated monomer carrying an unsaturated heterocycle having at least two nitrogen atoms, said monomer being preferably an ethylenically unsaturated imidazole, for treating a metallic surface for treating a metallic surface intended to be coated by a paint, a varnish or an adhesive, for example intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.