Peptides that form adhesive bonds, even in aqueous and/or saline environments, are disclosed. When aggregated, the peptides may be used in methods for producing hydrogels and/or adhesive materials. Synthetic peptide analogs are provided that are designed based on protein sequences found in barnacle adhesive, and may optionally be augmented with chemistry from other organisms that secrete proteins that adhere to substrates. The peptides may be used, for example, in biomedical and aqueous applications. Methods of using the aggregated peptides as adhesives are also provided.

Peptides that form adhesive bonds, even in aqueous and/or saline environments, are disclosed. When aggregated, the peptides may be used in methods for producing hydrogels and/or adhesive materials. Synthetic peptide analogs are provided that are designed based on protein sequences found in barnacle adhesive, and may optionally be augmented with chemistry from other organisms that secrete proteins that adhere to substrates. The peptides may be used, for example, in biomedical and aqueous applications. Methods of using the aggregated peptides as adhesives are also provided.

Embodiments of the present invention are directed to a two-layer adhesive and methods of using the same to secure an electronic device to an organism. In a non-limiting embodiment of the invention, a surface of the organism is coated with a first adhesive layer (bottom layer). The first adhesive layer is cured and a surface of the cured first adhesive layer is coated with a second adhesive layer (top layer). An electronic device is positioned on the second adhesive layer prior to curing the second adhesive layer. The second adhesive layer is then cured, thereby embedding the electronic device within the second adhesive layer. The bottom layer and the top layer are selected such that the bottom layer releases upon exposure to a first solvent after a first duration and the top layer releases upon exposure to a second solvent after a second duration more than the first duration.

A two-component curing adhesive using a curing reaction between a polyisocyanate composition (X) and a polyol composition (Y), wherein the polyisocyanate composition (X) includes a polyisocyanate (A), the polyol composition (Y) includes a polyol (B) and a polyamine (C), the polyamine (C) includes a compound having two or more —NH.sub.2 groups in a molecule thereof, and the polyisocyanate composition. (X) and the polyol composition (Y) each have an elongational viscosity of 0.1 to 10 Pa.Math.s.

The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or cyanoacrylate, and contacting first and second substrate.

The present teachings contemplate a method comprising providing a first and second substrate, locating an initiator onto a surface of the first or second substrate, the initiator including a substance for initiating polymerization of a polymerizable adhesive, locating the polymerizable adhesive onto a surface of the first and second substrate, the adhesive including a monofunctional, difunctional, or multifunctional methylene malonate, or cyanoacrylate, and contacting first and second substrate.

A method for assembling two parts, referred to as first and second parts, the first part being produced from composite material with fibrous reinforcement embedded in a thermosetting or thermoplastic matrix, the method comprising the steps of: obtaining the first part comprising, on all or part of an outer surface, a first amorphous thermoplastic film; positioning the first part and the second part such that the first amorphous thermoplastic film is placed opposite the second part; introducing a thermosetting resin between the first amorphous thermoplastic film and the second part; at least partially polymerising the thermosetting resin. When the two parts comprise an amorphous thermoplastic film, the parts are positioned such that the respective amorphous thermoplastic films are placed opposite each other, and the thermosetting resin is introduced between the amorphous thermoplastic films.

The present invention relates to a thermally conductive polyurethane adhesive composition having excellent mechanical properties as well as improved performance after aging and a method of manufacturing the same. Further, the present invention relates to method of manufacturing an article comprising the thermally conductive polyurethane adhesive composition and articles obtainable by the described method.

The present invention relates to a thermally conductive polyurethane adhesive composition having excellent mechanical properties as well as improved performance after aging and a method of manufacturing the same. Further, the present invention relates to method of manufacturing an article comprising the thermally conductive polyurethane adhesive composition and articles obtainable by the described method.

Provided is a curable-type composition, including a methylene malonate compound, a Lewis acidic compound, and a photo base generator.