Patent classifications
C09J5/04
Method for producing a multilayer film
A method for producing a multilayer film including at least two layers joined by a two-component adhesive includes the following steps: spreading a first component A of a two-component adhesive on a first face of a first layer of film; spreading a second component B of the two-component adhesive on a first face of a second layer of film; bringing the first and second faces of the first and second layers into mutual contact joining the components and to form an adhesive and join the two layers in a multilayer film; and winding the multilayer film obtained.
Nanofibrillated cellulose ply bonding agent or adhesive and multi-ply absorbent sheet made therewith
A ply-bonding agent or adhesive composition characterized by a viscosity and a surface tension for the manufacture of paper tissue and paper towel, includes: (a) water; (b) nanofibrillated cellulose; and (c) one or more modifiers effective to modify either or both of (i) the viscosity of the composition or (ii) the surface tension of the composition, wherein the one or more additional modifiers are selected from the group consisting of components (iii), (iv), (v), (vi), (vii) or (viii), wherein: (iii) is PVOH and a viscosity modifier; (iv) is a viscosity modifier; (v) is a viscosity modifier and a surface tension modifier other than PVOH; (vi) is a water-soluble cellulose derivative; (vii) is a water soluble polyol; and (viii) is a surface tension modifier other than PVOH. The compositions are particularly useful for ply-bonding multi-ply absorbent sheet when the plies are treated with debonder.
Nanofibrillated cellulose ply bonding agent or adhesive and multi-ply absorbent sheet made therewith
A ply-bonding agent or adhesive composition characterized by a viscosity and a surface tension for the manufacture of paper tissue and paper towel, includes: (a) water; (b) nanofibrillated cellulose; and (c) one or more modifiers effective to modify either or both of (i) the viscosity of the composition or (ii) the surface tension of the composition, wherein the one or more additional modifiers are selected from the group consisting of components (iii), (iv), (v), (vi), (vii) or (viii), wherein: (iii) is PVOH and a viscosity modifier; (iv) is a viscosity modifier; (v) is a viscosity modifier and a surface tension modifier other than PVOH; (vi) is a water-soluble cellulose derivative; (vii) is a water soluble polyol; and (viii) is a surface tension modifier other than PVOH. The compositions are particularly useful for ply-bonding multi-ply absorbent sheet when the plies are treated with debonder.
BONDED STRUCTURE
A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
BONDED STRUCTURE
A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
Wet adhesive peptides
Peptides that form adhesive bonds, even in aqueous and/or saline environments, are disclosed. When aggregated, the peptides may be used in methods for producing hydrogels and/or adhesive materials. Synthetic peptide analogs are provided that are designed based on protein sequences found in barnacle adhesive, and may optionally be augmented with chemistry from other organisms that secrete proteins that adhere to substrates. The peptides may be used, for example, in biomedical and aqueous applications. Methods of using the aggregated peptides as adhesives are also provided.
Wet adhesive peptides
Peptides that form adhesive bonds, even in aqueous and/or saline environments, are disclosed. When aggregated, the peptides may be used in methods for producing hydrogels and/or adhesive materials. Synthetic peptide analogs are provided that are designed based on protein sequences found in barnacle adhesive, and may optionally be augmented with chemistry from other organisms that secrete proteins that adhere to substrates. The peptides may be used, for example, in biomedical and aqueous applications. Methods of using the aggregated peptides as adhesives are also provided.
Two-layer adhesion of electronics to a surface
Embodiments of the present invention are directed to a two-layer adhesive and methods of using the same to secure an electronic device to an organism. In a non-limiting embodiment of the invention, a surface of the organism is coated with a first adhesive layer (bottom layer). The first adhesive layer is cured and a surface of the cured first adhesive layer is coated with a second adhesive layer (top layer). An electronic device is positioned on the second adhesive layer prior to curing the second adhesive layer. The second adhesive layer is then cured, thereby embedding the electronic device within the second adhesive layer. The bottom layer and the top layer are selected such that the bottom layer releases upon exposure to a first solvent after a first duration and the top layer releases upon exposure to a second solvent after a second duration more than the first duration.
Methods of assembling apparel products having thioester adhesives
Embodiments provide methods for assembling an apparel product. The methods include applying a composition to a portion of a major component of the apparel product or a portion of a minor component of the apparel product. The methods include applying the portion of the minor component with the portion of the major component via the composition. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component with an adhesive. The methods include converting the composition to the adhesive to form the apparel product. The adhesive includes a material having a thioester bond.
Polymer bonding process
The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.