Apparatuses, methods, and systems are disclosed for an adhesive including an activated portion and an unactivated portion. The adhesive is interposed between and binds the first substrate to a second substrate. The unactivated portion includes moisture, and the activated portion is activated to adhere in response to the removal of moisture. Similarly, the unactivated portion of the adhesive may be activated in response to the removal of moisture, removal of air, applying radiation, heating, and/or catalyzing a functional group.

Apparatuses, methods, and systems are disclosed for an adhesive including an activated portion and an unactivated portion. The adhesive is interposed between and binds the first substrate to a second substrate. The unactivated portion includes moisture, and the activated portion is activated to adhere in response to the removal of moisture. Similarly, the unactivated portion of the adhesive may be activated in response to the removal of moisture, removal of air, applying radiation, heating, and/or catalyzing a functional group.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A fabric composite for a gypsum underlayment sound control mat includes a first layer including a spunbond polyolefin layer, a second layer including a nonwoven polyolefin layer, and a hot-melt adhesive layer between and bonding the first layer and the second layer. A gypsum underlayment sound control mat may include the fabric composite bonded to an entangled mesh layer. A flooring system may include a gypsum or gypsum-concrete underlayment over the fabric composite or the mat. The fabric composite may be free of halogenated agents.

A fabric composite for a gypsum underlayment sound control mat includes a first layer including a spunbond polyolefin layer, a second layer including a nonwoven polyolefin layer, and a hot-melt adhesive layer between and bonding the first layer and the second layer. A gypsum underlayment sound control mat may include the fabric composite bonded to an entangled mesh layer. A flooring system may include a gypsum or gypsum-concrete underlayment over the fabric composite or the mat. The fabric composite may be free of halogenated agents.

Presently described are energy-curable resins, compositions, thermosets, coatings, and methods thereof. The curable resins described herein are (meth)acrylated resins derived from distilled tall oil rosin acids, distilled tall oil fatty acids, or a combination thereof. The curable resins can also include derivatives from rosin acids and/or fatty acids, such as cycloaddition products. The curable compositions undergo fast curing using UV and/or EB and provide enhanced performance of coatings, films, and printing inks, especially adhesion, stability and flexibility.

Presently described are energy-curable resins, compositions, thermosets, coatings, and methods thereof. The curable resins described herein are (meth)acrylated resins derived from distilled tall oil rosin acids, distilled tall oil fatty acids, or a combination thereof. The curable resins can also include derivatives from rosin acids and/or fatty acids, such as cycloaddition products. The curable compositions undergo fast curing using UV and/or EB and provide enhanced performance of coatings, films, and printing inks, especially adhesion, stability and flexibility.

A method of assembling an absorbent article having the steps of: a) providing a hot melt adhesive composition, wherein the adhesive has an amorphous polyolefin composition with more than 40% 1-butene and from about 10 wt. % to about 50 wt. % of a second amorphous polymer, and wherein the hot melt adhesive composition comprises less than 5% of a tackifier; b) providing a plurality of absorbent article components; and c) joining at least one of the absorbent article components to another of the absorbent article components using the adhesive so as to assemble the absorbent article.

A method of assembling an absorbent article having the steps of: a) providing a hot melt adhesive composition, wherein the adhesive has an amorphous polyolefin composition with more than 40% 1-butene and from about 10 wt. % to about 50 wt. % of a second amorphous polymer, and wherein the hot melt adhesive composition comprises less than 5% of a tackifier; b) providing a plurality of absorbent article components; and c) joining at least one of the absorbent article components to another of the absorbent article components using the adhesive so as to assemble the absorbent article.