A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

A moisture curable hot melt sealant composition that includes a silane-modified polyurethane polymer that is free of isocyanate groups, a first rosin-based tackifying agent, a second tackifying agent different from the first rosin-based tackifying agent, a first ethylene vinyl acetate copolymer, a butene component having a weight average molecular weight from 30,000 g/mole to 700,000 g/mole and being selected from the group consisting of polyisobutylene, polyisobutene, polybutene, and combinations thereof; and filler.

A moisture curable hot melt sealant composition that includes a silane-modified polyurethane polymer that is free of isocyanate groups, a first rosin-based tackifying agent, a second tackifying agent different from the first rosin-based tackifying agent, a first ethylene vinyl acetate copolymer, a butene component having a weight average molecular weight from 30,000 g/mole to 700,000 g/mole and being selected from the group consisting of polyisobutylene, polyisobutene, polybutene, and combinations thereof; and filler.

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.

Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.

Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.

A method of making an adhesive for an ice protection assembly includes mixing ferrous nanoparticles into the adhesive. Removal of the adhesive for ice protection assembly inspection or repair includes heating the ferrous nanoparticles in the adhesive to soften the adhesive and allow for easy removal or repositioning of the ice protection assembly.

A method of making an adhesive for an ice protection assembly includes mixing ferrous nanoparticles into the adhesive. Removal of the adhesive for ice protection assembly inspection or repair includes heating the ferrous nanoparticles in the adhesive to soften the adhesive and allow for easy removal or repositioning of the ice protection assembly.

In some embodiments, a printed laminate comprises a first substrate having a first side and a second side, an ink layer at least partially adhered through direct printing to the first side of the first substrate, and a second substrate comprising a heat activatable adhesive and having a first side and a second side. The first side of the second substrate may be at least partially laminated to the second side of the first substrate.