A plasticizer may be suitable for resins and contain an amorphous propylenic polymer having a weight-average molecular weight (Mw), measured according to a GPC method, in a range of from 5,000 to 30,000 and having a molecular weight distribution (Mw/Mn) of 3.0 or less. The amorphous propylenic polymer may be a propylene homopolymer

A hot melt pressure sensitive adhesive composition comprises: (a) a block copolymer comprising a first polymer block comprising an ethylene residue and a second polymer block comprising a C.sub.1 to C.sub.4 alkyl acrylate residue, wherein the block copolymer has a melt index as measured in accordance with ASTM D1238 of between about 0.1 and about 250 g/10 min; (b) a tackifying resin; and (c) a plasticizer. A method for making a laminate comprises the steps of: applying the hot melt pressure sensitive adhesive composition of the invention in a molten state to a primary substrate and allowing the adhesive to cool to form a bond with said primary substrate. Certain adhesives the invention perform comparably to certain styrene block copolymer adhesives, but provides an alternative polymer source.

A hot melt pressure sensitive adhesive composition comprises: (a) a block copolymer comprising a first polymer block comprising an ethylene residue and a second polymer block comprising a C.sub.1 to C.sub.4 alkyl acrylate residue, wherein the block copolymer has a melt index as measured in accordance with ASTM D1238 of between about 0.1 and about 250 g/10 min; (b) a tackifying resin; and (c) a plasticizer. A method for making a laminate comprises the steps of: applying the hot melt pressure sensitive adhesive composition of the invention in a molten state to a primary substrate and allowing the adhesive to cool to form a bond with said primary substrate. Certain adhesives the invention perform comparably to certain styrene block copolymer adhesives, but provides an alternative polymer source.

Disclosed herein is a bonding method for bonding two adherends using an adhesive main agent that contains a thermoplastic resin having a cross-linkable group and a catalyst. The bonding method includes the steps of forming a main agent layer on one of the adherends; applying a catalyst onto the main agent layer; laminating the main agent layer and another adherend; and heating and pressing a laminated body in a layer thickness direction. Another embodiment of the bonding method may include a step of applying a catalyst onto one of the adherends, a step of forming a main agent layer on a surface onto which the catalyst has been applied, a step of laminating the two adherends, and a step of heating and pressing a laminated body in a layer thickness direction.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range.

The invention features a hot melt adhesive composition including from 5% by weight to 50% by weight of a styrene block copolymer, from 15% by weight to 75% by weight of a bio-based tackifying agent, and from 5% by weight to 40% by weight of an aliphatic plasticizer having a cyclo-aliphatic content of no greater than 1% by weight as tested by .sup.1H-NMR Spectroscopy, wherein said hot melt adhesive composition has an environmentally conscious component content of at least 50% by weight.

The inventors have discovered hot melt adhesive compositions that can be formulated to have a high percentage of environmentally conscious components and still provide performance over a broad temperature range.

The invention features a hot melt adhesive composition including from 5% by weight to 50% by weight of a styrene block copolymer, from 15% by weight to 75% by weight of a bio-based tackifying agent, and from 5% by weight to 40% by weight of an aliphatic plasticizer having a cyclo-aliphatic content of no greater than 1% by weight as tested by .sup.1H-NMR Spectroscopy, wherein said hot melt adhesive composition has an environmentally conscious component content of at least 50% by weight.

A laminate structure and method of forming is provided. The laminate structure includes a first metal sheet having a first thickness, a second metal sheet having a second thickness, and an adhesive core having an adhesive thickness. The adhesive core is disposed between and bonded to the first and second metal sheets. The first and second metal sheets are made of an aluminum based material and the adhesive core is made of an adhesive material also described as a viscoelastic adhesive material. The laminate structure is configured such that a ratio of the sum of the first and second thickness to the adhesive thickness is greater than either to one (8:1). The laminate structure including the viscoelastic adhesive core is characterized by a composite loss factor at 1,000 Hertz which is continuously greater than 0.1 within a temperature range of 25 degrees Celsius to 50 degrees Celsius.

The present invention provides a metal-plastic composite material having excellent adhesive strength and formability and a method for manufacturing the same, and specifically, the present invention provides a metal-plastic composite material and a method for manufacturing the same comprising: a metal layer; and a plastic layer on at least one surface of the metal layer, wherein a thin film layer formed of a silane coupling agent is provided between the metal layer and the plastic layer, and the metal layer and the plastic layer are bonded by covalent bonding with the silane coupling agent.